跳到主要內容
Moov logo
Moov Icon
INFOTECH AUTOMATION IC-1600
    描述
    Same platform (Infotech Die/Hybrid Bonder) Power Spec (V/kW) - 380V 3KW Dimensions L×W×H (mm) - 1614*1215*2050 Weight (kg) - 1690 Accessories Completeness - Main machine +IUPC loading and unloading
    配置
    Cell Footprint - ≈1600 mm class Placement Heads - Same platform (Infotech Die/Hybrid Bonder) Wafer Handling - Same platform (Infotech Die/Hybrid Bonder) Wafer Changer & Feeder -Same platform (Infotech Die/Hybrid Bonder) Placement Accuracy - Same platform (Infotech Die/Hybrid Bonder) Process Capability - Same platform (Infotech Die/Hybrid Bonder) Workpiece Transport - Same platform (Infotech Die/Hybrid Bonder) Perform Feeding - Same platform (Infotech Die/Hybrid Bonder) Heating & Bond Force - Same platform (Infotech Die/Hybrid Bonder) System Interface - Same platform (Infotech Die/Hybrid Bonder) Standard Features - Same platform (Infotech Die/Hybrid Bonder)
    OEM 代工型號說明
    Die Bonder
    文檔

    無文檔

    INFOTECH AUTOMATION

    IC-1600

    verified-listing-icon

    已驗證

    類別
    Die Bonders / Sorters / Attachers

    上次驗證: 昨日

    關鍵商品詳情
    條件:

    Used

    作業狀態:

    未知

    產品編號:

    153371

    晶圓尺寸:

    未知

    年份:

    2022

    Logistics Support
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    類似上架商品
    查看全部
    INFOTECH AUTOMATION IC-1600

    INFOTECH AUTOMATION

    IC-1600

    Die Bonders / Sorters / Attachers
    年份: 2022條件: 二手
    上次驗證昨日
    INFOTECH AUTOMATION IC-1600

    INFOTECH AUTOMATION

    IC-1600

    Die Bonders / Sorters / Attachers
    年份: 2022條件: 二手
    上次驗證昨日

    INFOTECH AUTOMATION

    IC-1600

    verified-listing-icon
    已驗證
    類別
    Die Bonders / Sorters / Attachers
    上次驗證: 昨日
    listing-photo-81b6aab50738400080fc41aa47c91d89-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/93230/81b6aab50738400080fc41aa47c91d89/c313dcb617d940ff9f1dfe5de2c0c709_1_mw.jpg
    listing-photo-81b6aab50738400080fc41aa47c91d89-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/93230/81b6aab50738400080fc41aa47c91d89/d1b9b6ac9cf24234a9709c402b92615e_2_mw.png
    關鍵商品詳情
    條件:

    Used

    作業狀態:

    未知

    產品編號:

    153371

    晶圓尺寸:

    未知

    年份:

    2022

    Logistics Support
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    描述
    Same platform (Infotech Die/Hybrid Bonder) Power Spec (V/kW) - 380V 3KW Dimensions L×W×H (mm) - 1614*1215*2050 Weight (kg) - 1690 Accessories Completeness - Main machine +IUPC loading and unloading
    配置
    Cell Footprint - ≈1600 mm class Placement Heads - Same platform (Infotech Die/Hybrid Bonder) Wafer Handling - Same platform (Infotech Die/Hybrid Bonder) Wafer Changer & Feeder -Same platform (Infotech Die/Hybrid Bonder) Placement Accuracy - Same platform (Infotech Die/Hybrid Bonder) Process Capability - Same platform (Infotech Die/Hybrid Bonder) Workpiece Transport - Same platform (Infotech Die/Hybrid Bonder) Perform Feeding - Same platform (Infotech Die/Hybrid Bonder) Heating & Bond Force - Same platform (Infotech Die/Hybrid Bonder) System Interface - Same platform (Infotech Die/Hybrid Bonder) Standard Features - Same platform (Infotech Die/Hybrid Bonder)
    OEM 代工型號說明
    Die Bonder
    文檔

    無文檔

    類似上架商品
    查看全部
    INFOTECH AUTOMATION IC-1600

    INFOTECH AUTOMATION

    IC-1600

    Die Bonders / Sorters / Attachers年份: 2022條件: 二手上次驗證:昨日
    INFOTECH AUTOMATION IC-1600

    INFOTECH AUTOMATION

    IC-1600

    Die Bonders / Sorters / Attachers年份: 2022條件: 二手上次驗證:昨日