描述
Die / Hybrid Bonder Power Spec (V/kW) - 380V 3.6KW Dimensions L×W×H (mm) - 1815*1215*2050 Weight (kg) - 2000 Accessories Completeness - Main machine +IUPC loading and unloading配置
Cell Footprint - ≈1800 mm class Placement Heads - Same platform (Infotech Die/Hybrid Bonder) Wafer Handling - Same platform (Infotech Die/Hybrid Bonder) Wafer Changer & Feeder -Same platform (Infotech Die/Hybrid Bonder) Placement Accuracy - Same platform (Infotech Die/Hybrid Bonder) Process Capability - Same platform (Infotech Die/Hybrid Bonder) Workpiece Transport - Same platform (Infotech Die/Hybrid Bonder) Perform Feeding - Same platform (Infotech Die/Hybrid Bonder) Heating & Bond Force - Same platform (Infotech Die/Hybrid Bonder) System Interface - Same platform (Infotech Die/Hybrid Bonder) Standard Features - Same platform (Infotech Die/Hybrid Bonder)OEM 代工型號說明
Die Bonder文檔
無文檔
類別
Die Bonders / Sorters / Attachers
上次驗證: 昨日
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
154525
晶圓尺寸:
未知
年份:
2022
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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INFOTECH AUTOMATION
IC-1800
類別
Die Bonders / Sorters / Attachers
上次驗證: 昨日
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
154525
晶圓尺寸:
未知
年份:
2022
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
Die / Hybrid Bonder Power Spec (V/kW) - 380V 3.6KW Dimensions L×W×H (mm) - 1815*1215*2050 Weight (kg) - 2000 Accessories Completeness - Main machine +IUPC loading and unloading配置
Cell Footprint - ≈1800 mm class Placement Heads - Same platform (Infotech Die/Hybrid Bonder) Wafer Handling - Same platform (Infotech Die/Hybrid Bonder) Wafer Changer & Feeder -Same platform (Infotech Die/Hybrid Bonder) Placement Accuracy - Same platform (Infotech Die/Hybrid Bonder) Process Capability - Same platform (Infotech Die/Hybrid Bonder) Workpiece Transport - Same platform (Infotech Die/Hybrid Bonder) Perform Feeding - Same platform (Infotech Die/Hybrid Bonder) Heating & Bond Force - Same platform (Infotech Die/Hybrid Bonder) System Interface - Same platform (Infotech Die/Hybrid Bonder) Standard Features - Same platform (Infotech Die/Hybrid Bonder)OEM 代工型號說明
Die Bonder文檔
無文檔