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描述
Vintage-2017-2018 Complete Working Condition Ready For Production配置
2200 EVO (3GL) -See photos for configurationOEM 代工型號說明
The Datacon 2200 evo is a high-accuracy multi-chip die bonder designed to offer exceptional flexibility for die attach and flip chip applications in the semiconductor industry. It comes equipped with advanced features such as an integrated dispenser, 12-inch wafer handling capability, automatic tool changer, and application-specific tooling. The machine is well-prepared to handle a wide range of present and future processes and products, making it a versatile and reliable choice for semiconductor manufacturing.文檔
無文檔
PREFERRED
SELLER
類別
Die Bonders / Sorters / Attachers
上次驗證: 超過30天前
Buyer pays 12% premium of final sale price
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
80504
晶圓尺寸:
未知
年份:
2018
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
類似上架商品
查看全部
PREFERRED
SELLER
BESI / DATACON
2200 EVO
類別
Die Bonders / Sorters / Attachers
上次驗證: 超過30天前
Buyer pays 12% premium of final sale price
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
80504
晶圓尺寸:
未知
年份:
2018
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
Vintage-2017-2018 Complete Working Condition Ready For Production配置
2200 EVO (3GL) -See photos for configurationOEM 代工型號說明
The Datacon 2200 evo is a high-accuracy multi-chip die bonder designed to offer exceptional flexibility for die attach and flip chip applications in the semiconductor industry. It comes equipped with advanced features such as an integrated dispenser, 12-inch wafer handling capability, automatic tool changer, and application-specific tooling. The machine is well-prepared to handle a wide range of present and future processes and products, making it a versatile and reliable choice for semiconductor manufacturing.文檔
無文檔