描述
BESI Datacon 2200 EVO Flexible Multi-Chip Die Bonder High accuracy and high productivity DOM: 2019 Less than 100 operating hours...VERY LOW USE! Wafer Table Tool Changer Unit 7 Slots Main – Musashi Super Sigma V2 Internal Vacuum Pump P-part at Main AXIS Microscope 12" (FF-123) adapter for 2" and/or 4" Wafflepacks and Gelpaks (4x 2" and 2x 4") 2" WP-Adapter (12"-FF123) - 23 up - side clamp (any WT) 4" WP-Adapter - (12"-FF123) - 7 up - side clamp (std WT) 2" GP-Adapter - (12"-FF123) - 22 up - (any WT) 4" GP-Adapter - 12" (FF123) - 7 up - (std WT)配置
無配置OEM 代工型號說明
The Datacon 2200 evo is a high-accuracy multi-chip die bonder designed to offer exceptional flexibility for die attach and flip chip applications in the semiconductor industry. It comes equipped with advanced features such as an integrated dispenser, 12-inch wafer handling capability, automatic tool changer, and application-specific tooling. The machine is well-prepared to handle a wide range of present and future processes and products, making it a versatile and reliable choice for semiconductor manufacturing.文檔
無文檔
類別
Die Bonders / Sorters / Attachers
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
118453
晶圓尺寸:
未知
年份:
2019
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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BESI / DATACON
2200 EVO
類別
Die Bonders / Sorters / Attachers
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
118453
晶圓尺寸:
未知
年份:
2019
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
BESI Datacon 2200 EVO Flexible Multi-Chip Die Bonder High accuracy and high productivity DOM: 2019 Less than 100 operating hours...VERY LOW USE! Wafer Table Tool Changer Unit 7 Slots Main – Musashi Super Sigma V2 Internal Vacuum Pump P-part at Main AXIS Microscope 12" (FF-123) adapter for 2" and/or 4" Wafflepacks and Gelpaks (4x 2" and 2x 4") 2" WP-Adapter (12"-FF123) - 23 up - side clamp (any WT) 4" WP-Adapter - (12"-FF123) - 7 up - side clamp (std WT) 2" GP-Adapter - (12"-FF123) - 22 up - (any WT) 4" GP-Adapter - 12" (FF123) - 7 up - (std WT)配置
無配置OEM 代工型號說明
The Datacon 2200 evo is a high-accuracy multi-chip die bonder designed to offer exceptional flexibility for die attach and flip chip applications in the semiconductor industry. It comes equipped with advanced features such as an integrated dispenser, 12-inch wafer handling capability, automatic tool changer, and application-specific tooling. The machine is well-prepared to handle a wide range of present and future processes and products, making it a versatile and reliable choice for semiconductor manufacturing.文檔
無文檔