描述
The revolutionary Phi-Y pick-and-place produces a quantum leap in speed, with an increasing standard accuracy of 20 um. Optionally, the accuracy can even be improved, down to 15 um. Minimal distances between pick and bond positions coupled with the stiff symmetrical bond head and vibration compensation provide the shortest settling times imaginable, which ultimately lead to the unsurpassed speed of the Die Bonder Esec 2100 xPplus.配置
無配置OEM 代工型號說明
The Fastest 12" Epoxy Die Bonder The revolutionary Phi-Y pick-and-place produces a quantum leap in speed, with an increasing standard accuracy of 20 µm. Optionally, the accuracy can even be improved, down to 15 µm. minimal distances between pick and bond positions coupled with the stiff symmetrical bondhead and vibration compensation provide the shortest settling times imaginable, which ultimately lead to unsurpassed speed of the Die Bonder Esec 2100 xP plus.文檔
無文檔
BESI / ESEC
2100 xP plus
已驗證
類別
Die Bonders / Sorters / Attachers
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
79188
晶圓尺寸:
未知
年份:
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
BESI / ESEC
2100 xP plus
類別
Die Bonders / Sorters / Attachers
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
79188
晶圓尺寸:
未知
年份:
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
The revolutionary Phi-Y pick-and-place produces a quantum leap in speed, with an increasing standard accuracy of 20 um. Optionally, the accuracy can even be improved, down to 15 um. Minimal distances between pick and bond positions coupled with the stiff symmetrical bond head and vibration compensation provide the shortest settling times imaginable, which ultimately lead to the unsurpassed speed of the Die Bonder Esec 2100 xPplus.配置
無配置OEM 代工型號說明
The Fastest 12" Epoxy Die Bonder The revolutionary Phi-Y pick-and-place produces a quantum leap in speed, with an increasing standard accuracy of 20 µm. Optionally, the accuracy can even be improved, down to 15 µm. minimal distances between pick and bond positions coupled with the stiff symmetrical bondhead and vibration compensation provide the shortest settling times imaginable, which ultimately lead to unsurpassed speed of the Die Bonder Esec 2100 xP plus.文檔
無文檔