描述
無描述配置
無配置OEM 代工型號說明
The Die Bonder Esec 2100 hS is the 3rd generation of the most flexible 300 mm high speed platform, capable of running an extensive range of epoxy die attach applications such as QFN, TSOP, QFP, BGA, CSP-BGA, SiP-BGA, FBGA and LGA. It is the most effortless system to run, assist and control production resulting in a quantum leap in throughput and yield at the lowest cost of ownership.文檔
無文檔
類別
Die Bonders / Sorters / Attachers
上次驗證: 今日
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
127863
晶圓尺寸:
未知
年份:
2017
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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BESI / ESEC
2100 hS
類別
Die Bonders / Sorters / Attachers
上次驗證: 今日
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
127863
晶圓尺寸:
未知
年份:
2017
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
無描述配置
無配置OEM 代工型號說明
The Die Bonder Esec 2100 hS is the 3rd generation of the most flexible 300 mm high speed platform, capable of running an extensive range of epoxy die attach applications such as QFN, TSOP, QFP, BGA, CSP-BGA, SiP-BGA, FBGA and LGA. It is the most effortless system to run, assist and control production resulting in a quantum leap in throughput and yield at the lowest cost of ownership.文檔
無文檔