描述
Flip Chip Die Bonder配置
- 0 µm accuracy - Up to 12k UPH - 230 VOEM 代工型號說明
The ESEC 2100 FC hS is the third generation of the highly regarded High-Speed Flip Chip platform, designed to handle a wide array of Flip Chip applications, including FCOL, FC-MIS, FC-SIP, FCCSP, FCBGA, and emerging packages like CSP-LED. This advanced bonder delivers exceptional ease of operation, providing seamless production control and assistance文檔
無文檔
類別
Die Bonders / Sorters / Attachers
上次驗證: 12 天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
152704
晶圓尺寸:
12"/300mm
年份:
2022
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
BESI / ESEC
2100 FC hS
類別
Die Bonders / Sorters / Attachers
上次驗證: 12 天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
152704
晶圓尺寸:
12"/300mm
年份:
2022
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
Flip Chip Die Bonder配置
- 0 µm accuracy - Up to 12k UPH - 230 VOEM 代工型號說明
The ESEC 2100 FC hS is the third generation of the highly regarded High-Speed Flip Chip platform, designed to handle a wide array of Flip Chip applications, including FCOL, FC-MIS, FC-SIP, FCCSP, FCBGA, and emerging packages like CSP-LED. This advanced bonder delivers exceptional ease of operation, providing seamless production control and assistance文檔
無文檔