Esec Soft Solder
> Not Installed Top Stock Module for LF handling but still included
> with workholder for OMP1
> lacking 2 Monitors
> with machine safety cover

BE Semiconductor Industries N.V. designs, develops, manufactures, markets and services die sorting, flip chip and multi-chip die bonding, packaging and plating equipment for the semiconductor industry's assembly operations.
Founded in 1968, Esec is a leading global manufacturer of die bonding equipment for the semiconductor, telecommunications and smart card industries based in Cham, Switzerland. It also manufactures and services wire bonding systems from its Singapore assembly facility.

BESI / ESEC

The ESEC 2009 SSIE is an advanced die bonder specifically designed to address the evolving demands of power die attach. Its exceptional productivity and precise process control set new industry standards. Utilizing patented soft solder process technologies, this die bonder ensures optimal results and helps maintain a leading market position. An outstanding feature of the ESEC 2009 SSIE is its capability to handle 300mm / 12" wafers, providing versatility and scalability for various applications.

2009 SSIE

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BESI / ESEC

2009 SSIE

Die Bonders / Sorters / Attachers

類似上架商品

BESI / ESEC

2009 SSIE

BESI / ESEC

2009 SSIE

2009 SSIE

Die Bonders / Sorters / Attachers

類似上架商品

BESI / ESEC

2009 SSIE

BESI / ESEC

2009 SSIE