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描述
Esec Soft Solder > Not Installed Top Stock Module for LF handling but still included > lacking 1 Monitor > with machine safety cover配置
無配置OEM 代工型號說明
The ESEC 2009 SSIE is an advanced die bonder specifically designed to address the evolving demands of power die attach. Its exceptional productivity and precise process control set new industry standards. Utilizing patented soft solder process technologies, this die bonder ensures optimal results and helps maintain a leading market position. An outstanding feature of the ESEC 2009 SSIE is its capability to handle 300mm / 12" wafers, providing versatility and scalability for various applications.文檔
無文檔
類別
Die Bonders / Sorters / Attachers
上次驗證: 26 天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
123088
晶圓尺寸:
未知
年份:
2018
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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BESI / ESEC
2009 SSIE
類別
Die Bonders / Sorters / Attachers
上次驗證: 26 天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
123088
晶圓尺寸:
未知
年份:
2018
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
Esec Soft Solder > Not Installed Top Stock Module for LF handling but still included > lacking 1 Monitor > with machine safety cover配置
無配置OEM 代工型號說明
The ESEC 2009 SSIE is an advanced die bonder specifically designed to address the evolving demands of power die attach. Its exceptional productivity and precise process control set new industry standards. Utilizing patented soft solder process technologies, this die bonder ensures optimal results and helps maintain a leading market position. An outstanding feature of the ESEC 2009 SSIE is its capability to handle 300mm / 12" wafers, providing versatility and scalability for various applications.文檔
無文檔