描述
Process: DIE BONDER配置
(Dual-Head)OEM 代工型號說明
ASMPT's ISLinDA is a cutting edge 12"; die bonder for stacked and thin die bonding capability. It is excellent in thin die handling employing various patented thin die ejecting systems. It can achieve high throughput and accuracy by a dual head system and a powerful vision system.文檔
無文檔
ASM
ISLinDA
已驗證
類別
Die Bonders / Sorters / Attachers
上次驗證: 超過30天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
114834
晶圓尺寸:
未知
年份:
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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ASM
ISLinDA
類別
Die Bonders / Sorters / Attachers
上次驗證: 超過30天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
114834
晶圓尺寸:
未知
年份:
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
Process: DIE BONDER配置
(Dual-Head)OEM 代工型號說明
ASMPT's ISLinDA is a cutting edge 12"; die bonder for stacked and thin die bonding capability. It is excellent in thin die handling employing various patented thin die ejecting systems. It can achieve high throughput and accuracy by a dual head system and a powerful vision system.文檔
無文檔