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ASM IS868LA2
  • ASM IS868LA2
  • ASM IS868LA2
  • ASM IS868LA2
描述
Glass Attached
配置
無配置
OEM 代工型號說明
The ASM IS868LA2 is a die bonder machine used in the semiconductor industry for attaching semiconductor chips to a substrate
文檔

無文檔

verified-listing-icon

已驗證

類別
Die Bonders / Sorters / Attachers

上次驗證: 超過60天前

關鍵商品詳情

條件:

Used


作業狀態:

未知


產品編號:

79422


晶圓尺寸:

未知


年份:

2010


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available

ASM

IS868LA2

verified-listing-icon
已驗證
類別
Die Bonders / Sorters / Attachers
上次驗證: 超過60天前
listing-photo-acc6079739fe4dcd818998093dea41d0-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
關鍵商品詳情

條件:

Used


作業狀態:

未知


產品編號:

79422


晶圓尺寸:

未知


年份:

2010


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
Glass Attached
配置
無配置
OEM 代工型號說明
The ASM IS868LA2 is a die bonder machine used in the semiconductor industry for attaching semiconductor chips to a substrate
文檔

無文檔