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描述
Specially designed for advanced IC and discrete packages,AD8312 provides a high speed automatic epoxy die bonding solution for alround IC and discrete applications. The high speed bonding performance and ecellent accuracy of ±1 mil@ 3 σ and MS Windows@ operating system makes AD8312 a perfect fit for your IC and discrete assembly solution.配置
無配置OEM 代工型號說明
The newly developed ASM Die Bonder AD8312 offers a wide range of benefits with the sole target of producing highest speed and quality at lowest cost per die placement. Special handling and operating aspects of stacked and thin die are incorporated in the revolutionary machine concept. The extremely fast vision system and the ultra-light pick and place head with his innovative linear motor technology offer an incredible increase in performance, product quality and yield.文檔
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ASM
AD8312
類別
Die Bonders / Sorters / Attachers
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
79141
晶圓尺寸:
未知
年份:
未知
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描述
Specially designed for advanced IC and discrete packages,AD8312 provides a high speed automatic epoxy die bonding solution for alround IC and discrete applications. The high speed bonding performance and ecellent accuracy of ±1 mil@ 3 σ and MS Windows@ operating system makes AD8312 a perfect fit for your IC and discrete assembly solution.配置
無配置OEM 代工型號說明
The newly developed ASM Die Bonder AD8312 offers a wide range of benefits with the sole target of producing highest speed and quality at lowest cost per die placement. Special handling and operating aspects of stacked and thin die are incorporated in the revolutionary machine concept. The extremely fast vision system and the ultra-light pick and place head with his innovative linear motor technology offer an incredible increase in performance, product quality and yield.文檔
無文檔