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ONTO / RUDOLPH / AUGUST NSX-95
    描述
    無描述
    配置
    無配置
    OEM 代工型號說明
    The NSX-95 is an automated inspection system that provides fast and consistent 100% 2D bump inspection and 3D bump height inspection. It ensures the quality of every process step and provides process and defect information for enhanced process control and product consistency. The system also features YieldPilot enhanced data and defect analysis. It has proven applications in semiconductor, optoelectronics, wafer bumping, data storage, micro electromechanical systems (MEMS) and micro display markets. The NSX-95 has a throughput of 43 wafers per hour for 12"/300mm wafers, 63 wafers per hour for 8"/200mm wafers, 76 wafers per hour for 6"/150mm wafers, 83 wafers per hour for 5"/150mm wafers, and 89 wafers per hour for 4"/100mm wafers.
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    ONTO / RUDOLPH / AUGUST

    NSX-95

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    已驗證

    類別

    Defect Inspection
    上次驗證: 超過60天前
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    條件:

    Used


    作業狀態:

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    產品編號:

    60464


    晶圓尺寸:

    未知


    年份:

    未知

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    ONTO / RUDOLPH / AUGUST NSX-95
    ONTO / RUDOLPH / AUGUSTNSX-95Defect Inspection
    年份: 0條件: 二手
    上次驗證超過60天前

    ONTO / RUDOLPH / AUGUST

    NSX-95

    verified-listing-icon

    已驗證

    類別

    Defect Inspection
    上次驗證: 超過60天前
    listing-photo-e6f478c46e494efb8b7e3e499537e2dd-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1689/60464/fb6a662d15e64d6bbd58bb245243382c_1054b37694a74e6d94b27c8d3491768aimage31scaled_mw.jpeg
    listing-photo-e6f478c46e494efb8b7e3e499537e2dd-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1689/60464/372f4f23e3de403c965cb8928784cabe_d33247d16b0d4ff399976ca5f5ed97adimage32scaled_mw.jpeg
    listing-photo-e6f478c46e494efb8b7e3e499537e2dd-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1689/60464/13de2dbca0f846e1857fa4f68cc60434_d417f396d5ba4b3ebf07125973dbd453image33scaled_mw.jpeg
    listing-photo-e6f478c46e494efb8b7e3e499537e2dd-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1689/60464/90b9babca44547e6a10495faf19b3295_08518b28cb104e9c84b030ef05613860image34scaled_mw.jpeg
    關鍵商品詳情

    條件:

    Used


    作業狀態:

    未知


    產品編號:

    60464


    晶圓尺寸:

    未知


    年份:

    未知


    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    描述
    無描述
    配置
    無配置
    OEM 代工型號說明
    The NSX-95 is an automated inspection system that provides fast and consistent 100% 2D bump inspection and 3D bump height inspection. It ensures the quality of every process step and provides process and defect information for enhanced process control and product consistency. The system also features YieldPilot enhanced data and defect analysis. It has proven applications in semiconductor, optoelectronics, wafer bumping, data storage, micro electromechanical systems (MEMS) and micro display markets. The NSX-95 has a throughput of 43 wafers per hour for 12"/300mm wafers, 63 wafers per hour for 8"/200mm wafers, 76 wafers per hour for 6"/150mm wafers, 83 wafers per hour for 5"/150mm wafers, and 89 wafers per hour for 4"/100mm wafers.
    文檔

    無文檔

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    ONTO / RUDOLPH / AUGUST NSX-95
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    ONTO / RUDOLPH / AUGUST NSX-95
    ONTO / RUDOLPH / AUGUST
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    Defect Inspection年份: 0條件: 二手上次驗證: 超過60天前
    ONTO / RUDOLPH / AUGUST NSX-95
    ONTO / RUDOLPH / AUGUST
    NSX-95
    Defect Inspection年份: 0條件: 二手上次驗證: 超過60天前