描述
Process: MACRO DEFECT INSPECTOR配置
無配置OEM 代工型號說明
The NSX-320 is an automated macro defect inspection system designed specifically for advanced packaging processes that use through silicon vias (TSVs). It is part of the NSX® family, which is the market leader in this field. The NSX 320 offers specific inspection solutions for processes using TSVs to connect multiple die in a single package, and also serves critical inspection needs for edge trimming metrology, wafer alignment during bonding processes, and sawn wafers on film frames. With high acceleration staging, high-speed multi-processor computing, and highly flexible software capabilities, the NSX 320 delivers industry-leading speed and sensitivity. It features a choice of inspection platforms with a hard-anodized finish that can accommodate 100mm to 300mm whole wafers. The objective turret provides flexibility for inspection applications requiring both high throughput and high resolution, with five available slots and a choice of 1X, 2X, 3X, 5X, 10X, and 20X objectives. The system also includes a programmable light tower, a standard docking module, and has a throughput of up to 120 wph (10µm). Recipe creation takes only five minutes, and the system offers resolution flexibility from 10µm to 0.5µm. It also features three simultaneous color defect review methods: on-the-fly, high resolution, and whole wafer. The NSX-320 can be teamed with edge and backside modules for an all-surface solution.文檔
無文檔
ONTO / RUDOLPH / AUGUST
NSX-320
已驗證
類別
Defect Inspection
上次驗證: 29 天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
114929
晶圓尺寸:
未知
年份:
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
ONTO / RUDOLPH / AUGUST
NSX-320
類別
Defect Inspection
上次驗證: 29 天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
114929
晶圓尺寸:
未知
年份:
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
Process: MACRO DEFECT INSPECTOR配置
無配置OEM 代工型號說明
The NSX-320 is an automated macro defect inspection system designed specifically for advanced packaging processes that use through silicon vias (TSVs). It is part of the NSX® family, which is the market leader in this field. The NSX 320 offers specific inspection solutions for processes using TSVs to connect multiple die in a single package, and also serves critical inspection needs for edge trimming metrology, wafer alignment during bonding processes, and sawn wafers on film frames. With high acceleration staging, high-speed multi-processor computing, and highly flexible software capabilities, the NSX 320 delivers industry-leading speed and sensitivity. It features a choice of inspection platforms with a hard-anodized finish that can accommodate 100mm to 300mm whole wafers. The objective turret provides flexibility for inspection applications requiring both high throughput and high resolution, with five available slots and a choice of 1X, 2X, 3X, 5X, 10X, and 20X objectives. The system also includes a programmable light tower, a standard docking module, and has a throughput of up to 120 wph (10µm). Recipe creation takes only five minutes, and the system offers resolution flexibility from 10µm to 0.5µm. It also features three simultaneous color defect review methods: on-the-fly, high resolution, and whole wafer. The NSX-320 can be teamed with edge and backside modules for an all-surface solution.文檔
無文檔