描述
無描述配置
無配置OEM 代工型號說明
The Dragonfly G3 system is a unique 2D imaging technology that provides fast, reliable inspection for sub-micron defects. It is designed to meet today’s R&D needs and tomorrow’s production demands. The system uses Onto Innovation’s patented Truebump® Technology, which combines multiple 3D metrology techniques to deliver accurate 100% bump height metrology and coplanarity. The Dragonfly G3 system also offers Clearfind® Technology for non-visual residue detection and is tightly integrated with control and analytical software for real-time analysis and review. It is suitable for a wide range of applications, including micro bumps, large die, multi-chip packages, reconstituted wafers, redistribution layers (RDL), CMOS image sensors (CIS), MEMS, and more. The system also offers flexible platform options, such as IR defect inspection and review, large die and package support, substrate handling options, waferless recipe creation, rule-based binning and classification, online and offline review capability, and more. Overall, the Dragonfly G3 system is a powerful tool for improving yields through exploratory data analysis down to the bump level.文檔
無文檔
類別
Defect Inspection
上次驗證: 7 天前
關鍵商品詳情
條件:
Used
作業狀態:
Installed / Running
產品編號:
142461
晶圓尺寸:
未知
年份:
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
ONTO / RUDOLPH / AUGUST
DRAGONFLY G3
類別
Defect Inspection
上次驗證: 7 天前
關鍵商品詳情
條件:
Used
作業狀態:
Installed / Running
產品編號:
142461
晶圓尺寸:
未知
年份:
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
無描述配置
無配置OEM 代工型號說明
The Dragonfly G3 system is a unique 2D imaging technology that provides fast, reliable inspection for sub-micron defects. It is designed to meet today’s R&D needs and tomorrow’s production demands. The system uses Onto Innovation’s patented Truebump® Technology, which combines multiple 3D metrology techniques to deliver accurate 100% bump height metrology and coplanarity. The Dragonfly G3 system also offers Clearfind® Technology for non-visual residue detection and is tightly integrated with control and analytical software for real-time analysis and review. It is suitable for a wide range of applications, including micro bumps, large die, multi-chip packages, reconstituted wafers, redistribution layers (RDL), CMOS image sensors (CIS), MEMS, and more. The system also offers flexible platform options, such as IR defect inspection and review, large die and package support, substrate handling options, waferless recipe creation, rule-based binning and classification, online and offline review capability, and more. Overall, the Dragonfly G3 system is a powerful tool for improving yields through exploratory data analysis down to the bump level.文檔
無文檔