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KLA 2401
  • KLA 2401
  • KLA 2401
  • KLA 2401
描述
Macro-Defect
配置
無配置
OEM 代工型號說明
The 2401 Automated Macro Defect Inspection System is a product by KLA-Tencor that replaces manual bright light macro defect inspection performed by operators. It provides automated detection, classification, and reporting of all yield-critical macro after-develop inspection defect types, including hotspots, scratches, large particles, extra and missing resist, unexposed fields, striations, developer spots and splashback. With sensitivity superior to that of operators, the 2401 Automated Macro Defect Inspection System detects defects reliably and repeatably, allowing for quick and accurate disposition decisions, reducing scrap and preventing further investment in low-yielding wafers.
文檔

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已驗證

類別
Defect Inspection

上次驗證: 超過30天前

關鍵商品詳情

條件:

Used


作業狀態:

未知


產品編號:

119861


晶圓尺寸:

8"/200mm


年份:

未知


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available

KLA

2401

verified-listing-icon
已驗證
類別
Defect Inspection
上次驗證: 超過30天前
listing-photo-700ac7ef9bc64faa9e24888c4d32881d-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
關鍵商品詳情

條件:

Used


作業狀態:

未知


產品編號:

119861


晶圓尺寸:

8"/200mm


年份:

未知


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
Macro-Defect
配置
無配置
OEM 代工型號說明
The 2401 Automated Macro Defect Inspection System is a product by KLA-Tencor that replaces manual bright light macro defect inspection performed by operators. It provides automated detection, classification, and reporting of all yield-critical macro after-develop inspection defect types, including hotspots, scratches, large particles, extra and missing resist, unexposed fields, striations, developer spots and splashback. With sensitivity superior to that of operators, the 2401 Automated Macro Defect Inspection System detects defects reliably and repeatably, allowing for quick and accurate disposition decisions, reducing scrap and preventing further investment in low-yielding wafers.
文檔

無文檔