描述
無描述配置
- SMIF TYPE - Remove from production 5 years ago - Stored in humidity and temperature controlled area - Part removed is the FFU (Fan Filtering unit)OEM 代工型號說明
The 2401 Automated Macro Defect Inspection System is a product by KLA-Tencor that replaces manual bright light macro defect inspection performed by operators. It provides automated detection, classification, and reporting of all yield-critical macro after-develop inspection defect types, including hotspots, scratches, large particles, extra and missing resist, unexposed fields, striations, developer spots and splashback. With sensitivity superior to that of operators, the 2401 Automated Macro Defect Inspection System detects defects reliably and repeatably, allowing for quick and accurate disposition decisions, reducing scrap and preventing further investment in low-yielding wafers.文檔
無文檔
KLA
2401
已驗證
類別
Defect Inspection
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
31623
晶圓尺寸:
未知
年份:
2000
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
KLA
2401
已驗證
類別
Defect Inspection
上次驗證: 超過30天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
31623
晶圓尺寸:
未知
年份:
2000
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
無描述配置
- SMIF TYPE - Remove from production 5 years ago - Stored in humidity and temperature controlled area - Part removed is the FFU (Fan Filtering unit)OEM 代工型號說明
The 2401 Automated Macro Defect Inspection System is a product by KLA-Tencor that replaces manual bright light macro defect inspection performed by operators. It provides automated detection, classification, and reporting of all yield-critical macro after-develop inspection defect types, including hotspots, scratches, large particles, extra and missing resist, unexposed fields, striations, developer spots and splashback. With sensitivity superior to that of operators, the 2401 Automated Macro Defect Inspection System detects defects reliably and repeatably, allowing for quick and accurate disposition decisions, reducing scrap and preventing further investment in low-yielding wafers.文檔
無文檔