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KLA SURFSCAN SP3
    描述
    Particle Measurement
    配置
    Main Components • Integrated Console • Bare Wafer Inspection Station • Equipment Front End Module (EFEM) • 3 Port Wafer Loading Unit Inspection System • Un-patterned wafer inspection platform to incorporate deep-ultraviolet (DUV) illumination. Deep Ultraviolet (DUV) source • DUV-specific apertures to enable defect capture on un-patterned thin films • High speed stage and advanced imaging computer for enhanced productivity • Full-wafer high-resolution haze maps Defect Detection & Classification Capabilities • Designed to capture a broad range of challenging defects for 32nm/22nm process nodes • High-productivity rapid automated defect classification • Coordinate accuracy to enable rapid defect re-detection and review • Integrated, high resolution (~100 mega-pixel), full-wafer SURFmonitor™ haze maps, providing automated capture of ultra-fine slip lines and scratches or maps of surface roughness, grain size and other process parameters • Surfscan SP3 system feature dramatic advances in sensitivity and throughput over their industry-benchmark predecessor, the Surfscan SP2XP • Inspection Module for the back side of wafers for defects that might deform the wafer shape.
    OEM 代工型號說明
    The Surfscan® SP3 is an unpatterned wafer inspection tool available in 450mm, 300mm, and 300mm/450mm bridge tool configurations. It uses deep ultra-violet (DUV) sensitivity and has a throughput up to three times that of its predecessor. It can detect critical defects and surface quality issues for IC, OEM, and substrate manufacturing at the 2Xnm design node. The tool also includes an integrated SURFmonitor module that characterizes and measures surface quality. It has flexible configurations and a reliable, extendible architecture. It is used for qualification and monitoring of process tools for the 2Xnm design node within the IC fab, as well as serving as a lithography process tool monitor. The Surfscan SP3 can also be used for incoming wafer qualification, inline process control, final wafer qualification, process tool qualification, and as a process uniformity monitor.
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    verified-listing-icon

    已驗證

    類別
    Defect Inspection

    上次驗證: 3 天前

    關鍵商品詳情

    條件:

    Used


    作業狀態:

    未知


    產品編號:

    155094


    晶圓尺寸:

    12"/300mm


    年份:

    未知


    Logistics Support
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    類似上架商品
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    KLA SURFSCAN SP3

    KLA

    SURFSCAN SP3

    Defect Inspection
    年份: 0條件: 二手
    上次驗證2 天前

    KLA

    SURFSCAN SP3

    verified-listing-icon
    已驗證
    類別
    Defect Inspection
    上次驗證: 3 天前
    listing-photo-b60eba5ed8f940aba07da81bbbd3d0e9-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
    關鍵商品詳情

    條件:

    Used


    作業狀態:

    未知


    產品編號:

    155094


    晶圓尺寸:

    12"/300mm


    年份:

    未知


    Logistics Support
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    描述
    Particle Measurement
    配置
    Main Components • Integrated Console • Bare Wafer Inspection Station • Equipment Front End Module (EFEM) • 3 Port Wafer Loading Unit Inspection System • Un-patterned wafer inspection platform to incorporate deep-ultraviolet (DUV) illumination. Deep Ultraviolet (DUV) source • DUV-specific apertures to enable defect capture on un-patterned thin films • High speed stage and advanced imaging computer for enhanced productivity • Full-wafer high-resolution haze maps Defect Detection & Classification Capabilities • Designed to capture a broad range of challenging defects for 32nm/22nm process nodes • High-productivity rapid automated defect classification • Coordinate accuracy to enable rapid defect re-detection and review • Integrated, high resolution (~100 mega-pixel), full-wafer SURFmonitor™ haze maps, providing automated capture of ultra-fine slip lines and scratches or maps of surface roughness, grain size and other process parameters • Surfscan SP3 system feature dramatic advances in sensitivity and throughput over their industry-benchmark predecessor, the Surfscan SP2XP • Inspection Module for the back side of wafers for defects that might deform the wafer shape.
    OEM 代工型號說明
    The Surfscan® SP3 is an unpatterned wafer inspection tool available in 450mm, 300mm, and 300mm/450mm bridge tool configurations. It uses deep ultra-violet (DUV) sensitivity and has a throughput up to three times that of its predecessor. It can detect critical defects and surface quality issues for IC, OEM, and substrate manufacturing at the 2Xnm design node. The tool also includes an integrated SURFmonitor module that characterizes and measures surface quality. It has flexible configurations and a reliable, extendible architecture. It is used for qualification and monitoring of process tools for the 2Xnm design node within the IC fab, as well as serving as a lithography process tool monitor. The Surfscan SP3 can also be used for incoming wafer qualification, inline process control, final wafer qualification, process tool qualification, and as a process uniformity monitor.
    文檔

    無文檔

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