描述
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STANDARD SPECIFICATIONS Windows System: Windows XP SP3 Main S/W : NGS 5.4 SR3 HF3 Wafer Size: 300mm SEMI Notch Carrier 3 Advantage SW CID, Phx, Shinko (load port) 8 user-conigurable LEDs to display the load port status Load/unload button for manual delivery hand-of Cassette / wafer mapping which allows the tool to generate a wafer map of the 300mm FOUP and detect wafer presence, empty slots and cross-slotted wafer. The wafer map can be displayed on the user screen and sent to a SECS host. Facilities Power: 208 VAC, 3W-N CDA: > 28.3 Nl/min, > 6.6791 kg /cm2 Vac: > 28.317 l/min, > -700 mm Hg Chamber Powder Coat Panels Kit 200/300mm Vacuum option Optical Filter Load port Vacuum 300mm Tripple FIMS Application 2mm Edge Exclusion Oblique Incidence Illumination (High / Standard / Low) Normal Incidence Illumination (High / Standard / Low) Enhanced XY Coordinates IDM SP2 Standard Classification package LPD-N Classification LPD-ES classification Grading and Sorting Spatial Filter (20 degree) Spatial Filter (40 degree) Spatial ilter (rough ilms) Spatial ilter (Back) High Sensitivity Inspect Mode High Throughput Inspect Mode Options Haze Haze Normalization Haze Analysis IC/OEM Mfg Surf Quality Recipe Wafer size. 300mm XY Calibration Wafer with irst Article HARDWARE CONFIGURATION Others 5 Color Light Tower (RBYGW) Ethernet NFS Client E84 enabled for OHT & AGV/RGV E87 (Based on E39) GEM/SECS and HSMS E40/ E94/ E90 / E116 Handler Secondary UI, Phoenix, SP2 Main Computer Intel®Xeon™ CPU 3.20GHz 3.5 GB RAM Memory DVD ROM Mouse Keyboard 3.5" Floppy NGS application software FEC computer Intel®Pentium®4 CPU 512 MB RAM MemoryOEM 代工型號說明
The Surfscan SP2 is an unpatterned wafer surface inspection tool that uses UV laser technology, darkfield optics, and advanced algorithms to detect defects as small as 30nm. It provides high sensitivity detection on engineered substrates and has a significant throughput increase over the prior-generation tool. It offers a single tool solution for three technology nodes and has comprehensive wafer surface inspection capabilities. It also enables faster root-cause analysis with improved coordinate accuracy and real-time defect classification capability.文檔
類別
Defect Inspection
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
129068
晶圓尺寸:
12"/300mm
年份:
2010
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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KLA
SURFSCAN SP2
類別
Defect Inspection
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
129068
晶圓尺寸:
12"/300mm
年份:
2010
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available