描述
無描述配置
30mw Argon Ion Laser, Vacuum Handling, currently configured for 2 x 200mm open-station Optional: 2 x 300mm Isoport with Asyst robot 2 x 200mm Open Station Tool software options: Oblique, GEMSECS Comport, HSMS, XY.OEM 代工型號說明
The SP1 is an unpatterned surface inspection system that can be configured with KLA-Tencor’s Triple-Beam Illumination™ (TBI) technology for exceptional sensitivity on rough films. This technology adds an oblique illumination beam to the SP1’s standard optical configuration, enhancing its ability to capture and distinguish all variations of pits, including crystal originated pits (COPs), from particles. The TBI option maintains the SP1’s axi-symmetric design and allows the use of Adaptive Collection Optics for superior capture of defects on different substrate surfaces.文檔
無文檔
KLA
SP1-TBI
已驗證
類別
Defect Inspection
關鍵商品詳情
條件:
Refurbished
作業狀態:
未知
產品編號:
74450
晶圓尺寸:
未知
年份:
2000
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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SP1-TBI
已驗證
類別
Defect Inspection
上次驗證: 超過60天前
關鍵商品詳情
條件:
Refurbished
作業狀態:
未知
產品編號:
74450
晶圓尺寸:
未知
年份:
2000
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
無描述配置
30mw Argon Ion Laser, Vacuum Handling, currently configured for 2 x 200mm open-station Optional: 2 x 300mm Isoport with Asyst robot 2 x 200mm Open Station Tool software options: Oblique, GEMSECS Comport, HSMS, XY.OEM 代工型號說明
The SP1 is an unpatterned surface inspection system that can be configured with KLA-Tencor’s Triple-Beam Illumination™ (TBI) technology for exceptional sensitivity on rough films. This technology adds an oblique illumination beam to the SP1’s standard optical configuration, enhancing its ability to capture and distinguish all variations of pits, including crystal originated pits (COPs), from particles. The TBI option maintains the SP1’s axi-symmetric design and allows the use of Adaptive Collection Optics for superior capture of defects on different substrate surfaces.文檔
無文檔