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KLA CANDELA CS10
  • KLA CANDELA CS10
  • KLA CANDELA CS10
  • KLA CANDELA CS10
  • KLA CANDELA CS10
  • KLA CANDELA CS10
  • KLA CANDELA CS10
描述
KLA-Tencor Candela CS10V *. Fully refurbished. Installed in Clean-room. Possible demo anytime.
配置
Working Illumination Source : 25 mW laser, 405 nm wavelength Operator Interface : Trackball and keyboard standard Substrate Thickness : 350 μm ~ 1,100 μm Substrate Material : Any clear or opaque polished surface [ Performance ] Defect Sensitivity 0.08 μm diameter PSL sphere equivalent > 95% capture rate(PSL on bare Si) Other Defects and Applications : Particles, scratches, stains, pits, and bumps. Sensitivity: Minimum detectable size for automatic defect classification: - Scratches: 100 μm long, 0.1 μm wide, 50 Å; deep. - Pits: 20 μm diameter, 50 Å; deep - Stains: 20 μm diameter, 10 Å; thick [ Application ] - Opaque substrates - EPI Layers - Transparent film coatings (SiC, GaN, Sapphire)
OEM 代工型號說明
The Candela CS10 Optical Surface Analyzer is a compact device that offers exceptional sensitivity to particles and scratches on 2"-12" wafers using dual-laser Optical X-Beam technology. It simultaneously measures phase shift, scattered light, reflected light, and topography to detect and classify wafer surface defects. It is well-suited for laboratory and low volume production applications, and is easy to learn and operate.
文檔

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類別
Defect Inspection

上次驗證: 超過60天前

關鍵商品詳情

條件:

Refurbished


作業狀態:

未知


產品編號:

65978


晶圓尺寸:

4"/100mm


年份:

2009


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available

KLA

CANDELA CS10

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已驗證
類別
Defect Inspection
上次驗證: 超過60天前
listing-photo-c1fc0bfd88b34d50b25155475d0dd83d-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1987/c1fc0bfd88b34d50b25155475d0dd83d/86d62b66289648fa980418af5dee6418_1_mw.jpg
listing-photo-c1fc0bfd88b34d50b25155475d0dd83d-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1987/c1fc0bfd88b34d50b25155475d0dd83d/1482f0167d5544d6951893781cdfb26d_2_mw.jpg
listing-photo-c1fc0bfd88b34d50b25155475d0dd83d-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1987/c1fc0bfd88b34d50b25155475d0dd83d/1ca24042d17445f8b622b8fe814aadff_3_mw.jpg
listing-photo-c1fc0bfd88b34d50b25155475d0dd83d-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1987/c1fc0bfd88b34d50b25155475d0dd83d/851d5f20aa364b8493390a0cd48f54b5_4_mw.jpg
listing-photo-c1fc0bfd88b34d50b25155475d0dd83d-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1987/c1fc0bfd88b34d50b25155475d0dd83d/b6f5c126fb724c5898a266ed38e782f8_6_mw.jpg
listing-photo-c1fc0bfd88b34d50b25155475d0dd83d-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1987/c1fc0bfd88b34d50b25155475d0dd83d/856774029a354c03905d8f679bb72d86_5_mw.jpg
關鍵商品詳情

條件:

Refurbished


作業狀態:

未知


產品編號:

65978


晶圓尺寸:

4"/100mm


年份:

2009


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
KLA-Tencor Candela CS10V *. Fully refurbished. Installed in Clean-room. Possible demo anytime.
配置
Working Illumination Source : 25 mW laser, 405 nm wavelength Operator Interface : Trackball and keyboard standard Substrate Thickness : 350 μm ~ 1,100 μm Substrate Material : Any clear or opaque polished surface [ Performance ] Defect Sensitivity 0.08 μm diameter PSL sphere equivalent > 95% capture rate(PSL on bare Si) Other Defects and Applications : Particles, scratches, stains, pits, and bumps. Sensitivity: Minimum detectable size for automatic defect classification: - Scratches: 100 μm long, 0.1 μm wide, 50 Å; deep. - Pits: 20 μm diameter, 50 Å; deep - Stains: 20 μm diameter, 10 Å; thick [ Application ] - Opaque substrates - EPI Layers - Transparent film coatings (SiC, GaN, Sapphire)
OEM 代工型號說明
The Candela CS10 Optical Surface Analyzer is a compact device that offers exceptional sensitivity to particles and scratches on 2"-12" wafers using dual-laser Optical X-Beam technology. It simultaneously measures phase shift, scattered light, reflected light, and topography to detect and classify wafer surface defects. It is well-suited for laboratory and low volume production applications, and is easy to learn and operate.
文檔

無文檔