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KLA CANDELA 8620
    描述
    KLA-Tencor Candela 8620 KLA-Tencor Candela 8620 Optical Surface Analyzer (OSA) is a laser-based inspection system for semiconductor and optoelectronic wafers. It is fully automated with integrated wafer handling for cassette-to-cassette operation. The Candela defect detection system simultaneously measures surface reflectivity and topography for automatic defect detection and classification. The defect detection system's inspection technology combines scatterometry, ellipsometry, reflectometry, and topographical analysis to non-destructively inspect wafer surfaces for defects, and film thickness uniformity, of opaque substrates, epi layers, and transparent film coatings (SiC, GaN, sapphire).
    配置
    - Cassette Handling - Laser: Oblique(50mW, 405nm), Normal(85mW, 660nm) - Spot size: 5㎛ x 4㎛. - Handler: Mapping, Wafer centering on chuck and FFM: OK, Wafer loading/unloading: OK - Particle detection: smaller than 0.08㎛ on silicon substrate. - Scratch: 0.1㎛ wide, 1~2nm deep. - Pits and Bumps: 20㎛ diameter, 50Å;; deep. - Stains: 20㎛ diameter, 10Å;; thick. - can be used for both epi and bare substrate. - can be used for Si, GaAs, Al2O3,SiC substrate. - Substrage thickness: 350㎛ ~ 1,300㎛. - Air Balance system ULPA and HEPA air filter(replaced new one). - Input Power 230V 6A 50/60Hz - Input Air: CDA 90 PSI
    OEM 代工型號說明
    The Candela 8620 is an automated defect inspection system for LED substrates and epitaxy wafers. It provides enhanced quality control for materials such as gallium nitride, sapphire, and silicon carbide. Its proprietary optical design and detection technology can detect sub-micron defects that are not consistently identified by current inspection methods. This enables a production line monitor for yield-limiting defects, improving MOCVD reactor uptime and yield. The system can detect defects such as micro-scratches, micro-cracks, missing bumps, resist voids, hexagonal pits, and epi cracks, which can impact device performance, yield, and reliability.
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    KLA

    CANDELA 8620

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    已驗證

    類別

    Defect Inspection
    上次驗證: 超過30天前
    關鍵商品詳情

    條件:

    Refurbished


    作業狀態:

    未知


    產品編號:

    65985


    晶圓尺寸:

    8"/200mm


    年份:

    2011

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    KLA CANDELA 8620
    KLACANDELA 8620Defect Inspection
    年份: 0條件: 翻新的
    上次驗證昨日

    KLA

    CANDELA 8620

    verified-listing-icon

    已驗證

    類別

    Defect Inspection
    上次驗證: 超過30天前
    listing-photo-3f9c3d33f5404b858197727af7a8ca47-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1987/3f9c3d33f5404b858197727af7a8ca47/a52730c0950146399637be01af4eaa1b_1_mw.jpg
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    listing-photo-3f9c3d33f5404b858197727af7a8ca47-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1987/3f9c3d33f5404b858197727af7a8ca47/94c2e486a50e427880ee3ec76ac7acde_5_mw.jpg
    關鍵商品詳情

    條件:

    Refurbished


    作業狀態:

    未知


    產品編號:

    65985


    晶圓尺寸:

    8"/200mm


    年份:

    2011


    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    描述
    KLA-Tencor Candela 8620 KLA-Tencor Candela 8620 Optical Surface Analyzer (OSA) is a laser-based inspection system for semiconductor and optoelectronic wafers. It is fully automated with integrated wafer handling for cassette-to-cassette operation. The Candela defect detection system simultaneously measures surface reflectivity and topography for automatic defect detection and classification. The defect detection system's inspection technology combines scatterometry, ellipsometry, reflectometry, and topographical analysis to non-destructively inspect wafer surfaces for defects, and film thickness uniformity, of opaque substrates, epi layers, and transparent film coatings (SiC, GaN, sapphire).
    配置
    - Cassette Handling - Laser: Oblique(50mW, 405nm), Normal(85mW, 660nm) - Spot size: 5㎛ x 4㎛. - Handler: Mapping, Wafer centering on chuck and FFM: OK, Wafer loading/unloading: OK - Particle detection: smaller than 0.08㎛ on silicon substrate. - Scratch: 0.1㎛ wide, 1~2nm deep. - Pits and Bumps: 20㎛ diameter, 50Å;; deep. - Stains: 20㎛ diameter, 10Å;; thick. - can be used for both epi and bare substrate. - can be used for Si, GaAs, Al2O3,SiC substrate. - Substrage thickness: 350㎛ ~ 1,300㎛. - Air Balance system ULPA and HEPA air filter(replaced new one). - Input Power 230V 6A 50/60Hz - Input Air: CDA 90 PSI
    OEM 代工型號說明
    The Candela 8620 is an automated defect inspection system for LED substrates and epitaxy wafers. It provides enhanced quality control for materials such as gallium nitride, sapphire, and silicon carbide. Its proprietary optical design and detection technology can detect sub-micron defects that are not consistently identified by current inspection methods. This enables a production line monitor for yield-limiting defects, improving MOCVD reactor uptime and yield. The system can detect defects such as micro-scratches, micro-cracks, missing bumps, resist voids, hexagonal pits, and epi cracks, which can impact device performance, yield, and reliability.
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