描述
KLA-Tencor Candela 8620 KLA-Tencor Candela 8620 Optical Surface Analyzer (OSA) is a laser-based inspection system for semiconductor and optoelectronic wafers. It is fully automated with integrated wafer handling for cassette-to-cassette operation. The Candela defect detection system simultaneously measures surface reflectivity and topography for automatic defect detection and classification. The defect detection system's inspection technology combines scatterometry, ellipsometry, reflectometry, and topographical analysis to non-destructively inspect wafer surfaces for defects, and film thickness uniformity, of opaque substrates, epi layers, and transparent film coatings (SiC, GaN, sapphire).配置
- Cassette Handling - Laser: Oblique(50mW, 405nm), Normal(85mW, 660nm) - Spot size: 5㎛ x 4㎛. - Handler: Mapping, Wafer centering on chuck and FFM: OK, Wafer loading/unloading: OK - Particle detection: smaller than 0.08㎛ on silicon substrate. - Scratch: 0.1㎛ wide, 1~2nm deep. - Pits and Bumps: 20㎛ diameter, 50Å;; deep. - Stains: 20㎛ diameter, 10Å;; thick. - can be used for both epi and bare substrate. - can be used for Si, GaAs, Al2O3,SiC substrate. - Substrage thickness: 350㎛ ~ 1,300㎛. - Air Balance system ULPA and HEPA air filter(replaced new one). - Input Power 230V 6A 50/60Hz - Input Air: CDA 90 PSIOEM 代工型號說明
The Candela 8620 is an automated defect inspection system for LED substrates and epitaxy wafers. It provides enhanced quality control for materials such as gallium nitride, sapphire, and silicon carbide. Its proprietary optical design and detection technology can detect sub-micron defects that are not consistently identified by current inspection methods. This enables a production line monitor for yield-limiting defects, improving MOCVD reactor uptime and yield. The system can detect defects such as micro-scratches, micro-cracks, missing bumps, resist voids, hexagonal pits, and epi cracks, which can impact device performance, yield, and reliability.文檔
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KLA
CANDELA 8620
已驗證
類別
Defect Inspection
上次驗證: 超過60天前
關鍵商品詳情
條件:
Refurbished
作業狀態:
未知
產品編號:
65985
晶圓尺寸:
8"/200mm
年份:
2011
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
KLA
CANDELA 8620
類別
Defect Inspection
上次驗證: 超過60天前
關鍵商品詳情
條件:
Refurbished
作業狀態:
未知
產品編號:
65985
晶圓尺寸:
8"/200mm
年份:
2011
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
KLA-Tencor Candela 8620 KLA-Tencor Candela 8620 Optical Surface Analyzer (OSA) is a laser-based inspection system for semiconductor and optoelectronic wafers. It is fully automated with integrated wafer handling for cassette-to-cassette operation. The Candela defect detection system simultaneously measures surface reflectivity and topography for automatic defect detection and classification. The defect detection system's inspection technology combines scatterometry, ellipsometry, reflectometry, and topographical analysis to non-destructively inspect wafer surfaces for defects, and film thickness uniformity, of opaque substrates, epi layers, and transparent film coatings (SiC, GaN, sapphire).配置
- Cassette Handling - Laser: Oblique(50mW, 405nm), Normal(85mW, 660nm) - Spot size: 5㎛ x 4㎛. - Handler: Mapping, Wafer centering on chuck and FFM: OK, Wafer loading/unloading: OK - Particle detection: smaller than 0.08㎛ on silicon substrate. - Scratch: 0.1㎛ wide, 1~2nm deep. - Pits and Bumps: 20㎛ diameter, 50Å;; deep. - Stains: 20㎛ diameter, 10Å;; thick. - can be used for both epi and bare substrate. - can be used for Si, GaAs, Al2O3,SiC substrate. - Substrage thickness: 350㎛ ~ 1,300㎛. - Air Balance system ULPA and HEPA air filter(replaced new one). - Input Power 230V 6A 50/60Hz - Input Air: CDA 90 PSIOEM 代工型號說明
The Candela 8620 is an automated defect inspection system for LED substrates and epitaxy wafers. It provides enhanced quality control for materials such as gallium nitride, sapphire, and silicon carbide. Its proprietary optical design and detection technology can detect sub-micron defects that are not consistently identified by current inspection methods. This enables a production line monitor for yield-limiting defects, improving MOCVD reactor uptime and yield. The system can detect defects such as micro-scratches, micro-cracks, missing bumps, resist voids, hexagonal pits, and epi cracks, which can impact device performance, yield, and reliability.文檔
無文檔