Fully automated optical inspection for packaged semiconductor IC
Without PIC function

KLA Tencor T830 Pocket Integrity Check (PIC).pdf

KLA Tencor ICOS T830.pdf

KLA inhabits two worlds: one that’s nanometers in scale and one that’s global. This micro and macro view gives us a unique perspective. We see electrons wave and industries transform. When you put deep science together with optimism, big things happen.

Our process-control and process-enabling solutions are designed to boost the innovation speed of the electronics industry. We help our customers achieve leading-edge performance.

The ICOS T830 is a high-performance, fully automated optical inspection device for packaged integrated circuit (IC) components. It uses 2D and 3D measurements to determine the final package quality for a wide range of device types and sizes. It has four independent inspection stations and a component sorting station, allowing for high throughput and cost-effective component inspection. The ICOS T830 supports all IC package types, including leads, balls, pads, lands, and package-on-package interconnects. It also features fully automated tray pitch changeover and pocket integrity check to ensure there are no empty pockets or double units in the tray.

T830

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T830

Defect Inspection

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