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KLA T830
  • KLA T830
  • KLA T830
  • KLA T830
  • KLA T830
  • KLA T830
  • KLA T830
  • KLA T830
  • KLA T830
  • KLA T830
  • KLA T830
描述
Fully automated optical inspection for packaged semiconductor IC Without PIC function
配置
Power: 230/115V 1PH ; 2.07 KW ; 50/60Hz Air Pressure: 5.5 bar Required TEMP: 15-25℃ Size : L1800 mm、W1800 mm、H2100 mm Weight : 1300kg Module: Metrology Process: Inspection
OEM 代工型號說明
The ICOS T830 is a high-performance, fully automated optical inspection device for packaged integrated circuit (IC) components. It uses 2D and 3D measurements to determine the final package quality for a wide range of device types and sizes. It has four independent inspection stations and a component sorting station, allowing for high throughput and cost-effective component inspection. The ICOS T830 supports all IC package types, including leads, balls, pads, lands, and package-on-package interconnects. It also features fully automated tray pitch changeover and pocket integrity check to ensure there are no empty pockets or double units in the tray.
文檔
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已驗證

類別
Defect Inspection

上次驗證: 20 天前

關鍵商品詳情

條件:

Used


作業狀態:

Deinstalled


產品編號:

108725


晶圓尺寸:

8"/200mm


年份:

2014


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available

KLA

T830

verified-listing-icon
已驗證
類別
Defect Inspection
上次驗證: 20 天前
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關鍵商品詳情

條件:

Used


作業狀態:

Deinstalled


產品編號:

108725


晶圓尺寸:

8"/200mm


年份:

2014


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
Fully automated optical inspection for packaged semiconductor IC Without PIC function
配置
Power: 230/115V 1PH ; 2.07 KW ; 50/60Hz Air Pressure: 5.5 bar Required TEMP: 15-25℃ Size : L1800 mm、W1800 mm、H2100 mm Weight : 1300kg Module: Metrology Process: Inspection
OEM 代工型號說明
The ICOS T830 is a high-performance, fully automated optical inspection device for packaged integrated circuit (IC) components. It uses 2D and 3D measurements to determine the final package quality for a wide range of device types and sizes. It has four independent inspection stations and a component sorting station, allowing for high throughput and cost-effective component inspection. The ICOS T830 supports all IC package types, including leads, balls, pads, lands, and package-on-package interconnects. It also features fully automated tray pitch changeover and pocket integrity check to ensure there are no empty pockets or double units in the tray.
文檔