概述

The ICOS T830 is a high-performance, fully automated optical inspection device for packaged integrated circuit (IC) components. It uses 2D and 3D measurements to determine the final package quality for a wide range of device types and sizes. It has four independent inspection stations and a component sorting station, allowing for high throughput and cost-effective component inspection. The ICOS T830 supports all IC package types, including leads, balls, pads, lands, and package-on-package interconnects. It also features fully automated tray pitch changeover and pocket integrity check to ensure there are no empty pockets or double units in the tray.