描述
KLA-Tencor Candela CS20 Optical Defect Inspection配置
Wafer Size : 2 ~8 inch Illumination Source : 8mW laser, 635 nm wavelength Operator Interface : Trackball and keyboard standard Substrate Thickness : 350 μm ~ 1,100 μm Substrate Material : Any clear or opaque polished surface [ Performance ] Defect Sensitivity 0.08 μm diameter PSL sphere equivalent > 95% capture rate(PSL on bare Si) Other Defects and Applications : Particles, scratches, stains, pits, and bumps. Sensitivity: Minimum detectable size for automatic defect classification: - Scratches: 100 μm long, 0.1 μm wide, 50 Å; deep. - Pits: 20 μm diameter, 50 Å; deep - Stains: 20 μm diameter, 10 Å; thick [ Application ] - Opaque substrates - EPI Layers - Transparent film coatings (SiC, GaN, SapphireOEM 代工型號說明
The Candela CS20 system measures surface reflectivity and topography for automatic defect detection and classification. It uses scatterometry, ellipsometry, reflectometry, and topographical analysis to inspect wafer surfaces for defects and film thickness uniformity. It is designed for inspection of transparent materials such as sapphire and GaN and can detect a wide variety of defects. It is suitable for use in the production of High Brightness Light Emitting Diodes (HBLEDs), High-Power RF Devices, and Coated Glass (CMOS imagers, LCoS chips, etc.).文檔
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KLA
CANDELA CS20
已驗證
類別
Defect Inspection
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
101990
晶圓尺寸:
6"/150mm
年份:
2006
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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KLA
CANDELA CS20
類別
Defect Inspection
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
101990
晶圓尺寸:
6"/150mm
年份:
2006
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
KLA-Tencor Candela CS20 Optical Defect Inspection配置
Wafer Size : 2 ~8 inch Illumination Source : 8mW laser, 635 nm wavelength Operator Interface : Trackball and keyboard standard Substrate Thickness : 350 μm ~ 1,100 μm Substrate Material : Any clear or opaque polished surface [ Performance ] Defect Sensitivity 0.08 μm diameter PSL sphere equivalent > 95% capture rate(PSL on bare Si) Other Defects and Applications : Particles, scratches, stains, pits, and bumps. Sensitivity: Minimum detectable size for automatic defect classification: - Scratches: 100 μm long, 0.1 μm wide, 50 Å; deep. - Pits: 20 μm diameter, 50 Å; deep - Stains: 20 μm diameter, 10 Å; thick [ Application ] - Opaque substrates - EPI Layers - Transparent film coatings (SiC, GaN, SapphireOEM 代工型號說明
The Candela CS20 system measures surface reflectivity and topography for automatic defect detection and classification. It uses scatterometry, ellipsometry, reflectometry, and topographical analysis to inspect wafer surfaces for defects and film thickness uniformity. It is designed for inspection of transparent materials such as sapphire and GaN and can detect a wide variety of defects. It is suitable for use in the production of High Brightness Light Emitting Diodes (HBLEDs), High-Power RF Devices, and Coated Glass (CMOS imagers, LCoS chips, etc.).文檔
無文檔