描述
Dark Field. Software version 5.3.17, single open cassette handler. SECS II/GEM communication interface, include RTC option, 75MW 488nm Argon Laser, Multi Channel collection optics system with independent programmable spatial filters 10um single incident spot optics, additional 7um and 5 um spot size, flat panel display (AIT 2), Fold down keyboard tray with built-in mouse.配置
無配置OEM 代工型號說明
The AIT II is a patterned wafer inspection system for 150 to 300 mm wafers that provides fast, accurate feedback on process tool performance. It offers an integrated solution for automated defect classification and analysis, quickly turning defect data into yield-enhancing information. It is designed for flexibility in films, etch, photo, and CMP applications and offers advantages such as reducing process excursions, increasing overall equipment effectiveness, improving yield stability/predictability, and augmenting line monitoring.文檔
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KLA
AIT II
已驗證
類別
Defect Inspection
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
24647
晶圓尺寸:
8"/200mm
年份:
2000
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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KLA
AIT II
類別
Defect Inspection
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
24647
晶圓尺寸:
8"/200mm
年份:
2000
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
Dark Field. Software version 5.3.17, single open cassette handler. SECS II/GEM communication interface, include RTC option, 75MW 488nm Argon Laser, Multi Channel collection optics system with independent programmable spatial filters 10um single incident spot optics, additional 7um and 5 um spot size, flat panel display (AIT 2), Fold down keyboard tray with built-in mouse.配置
無配置OEM 代工型號說明
The AIT II is a patterned wafer inspection system for 150 to 300 mm wafers that provides fast, accurate feedback on process tool performance. It offers an integrated solution for automated defect classification and analysis, quickly turning defect data into yield-enhancing information. It is designed for flexibility in films, etch, photo, and CMP applications and offers advantages such as reducing process excursions, increasing overall equipment effectiveness, improving yield stability/predictability, and augmenting line monitoring.文檔
無文檔