描述
WI2250+HM200 The system allows defect inspection of whole and diced wafers up to 200mm, with macro inspection sensitivity in the pre- and post-dice inspection (i.e., front- and back-end) of high-brightness (HB) LEDs and MEMS wafers.配置
This tool is in good working condition with no missing parts or components, fully installed, and can be demonstrated.OEM 代工型號說明
The ICOS WI-2250 system's automated optical inspection capabilities enable higher quality LED and MEMS products at increased yields. The new system will allow defect inspection of whole and diced wafers up to 200mm, with macro inspection sensitivity in the pre- and post-dice inspection (i.e., front- and back-end) of high-brightness (HB) LEDs and MEMS wafers.文檔
無文檔
類別
Defect Inspection
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
57098
晶圓尺寸:
未知
年份:
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
KLA / ICOS
WI-2250
類別
Defect Inspection
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
57098
晶圓尺寸:
未知
年份:
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
WI2250+HM200 The system allows defect inspection of whole and diced wafers up to 200mm, with macro inspection sensitivity in the pre- and post-dice inspection (i.e., front- and back-end) of high-brightness (HB) LEDs and MEMS wafers.配置
This tool is in good working condition with no missing parts or components, fully installed, and can be demonstrated.OEM 代工型號說明
The ICOS WI-2250 system's automated optical inspection capabilities enable higher quality LED and MEMS products at increased yields. The new system will allow defect inspection of whole and diced wafers up to 200mm, with macro inspection sensitivity in the pre- and post-dice inspection (i.e., front- and back-end) of high-brightness (HB) LEDs and MEMS wafers.文檔
無文檔