描述
無描述配置
無配置OEM 代工型號說明
high resolution tool down to 3nm that performs hot spot inspection for both logic and memory fabs as a customers' process node goes into volume production. eP3 for 3nm is seeing demand from memory fabs' 25nm to 20nm migration.文檔
無文檔
類別
Defect Inspection
上次驗證: 昨日
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
158857
晶圓尺寸:
未知
年份:
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
ASML / HMI
eP3
類別
Defect Inspection
上次驗證: 昨日
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
158857
晶圓尺寸:
未知
年份:
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
無描述配置
無配置OEM 代工型號說明
high resolution tool down to 3nm that performs hot spot inspection for both logic and memory fabs as a customers' process node goes into volume production. eP3 for 3nm is seeing demand from memory fabs' 25nm to 20nm migration.文檔
無文檔