描述
無描述配置
QZ_DefectOEM 代工型號說明
high resolution tool down to 3nm that performs hot spot inspection for both logic and memory fabs as a customers' process node goes into volume production. eP3 for 3nm is seeing demand from memory fabs' 25nm to 20nm migration.文檔
無文檔
類別
Defect Inspection
上次驗證: 13 天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
144870
晶圓尺寸:
12"/300mm
年份:
2014
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
ASML / HMI
eP3
類別
Defect Inspection
上次驗證: 13 天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
144870
晶圓尺寸:
12"/300mm
年份:
2014
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
無描述配置
QZ_DefectOEM 代工型號說明
high resolution tool down to 3nm that performs hot spot inspection for both logic and memory fabs as a customers' process node goes into volume production. eP3 for 3nm is seeing demand from memory fabs' 25nm to 20nm migration.文檔
無文檔