Hitachi High-Tech offers a range of advanced industrial equipment solutions for assembly and processing machines used in the production of lithium batteries, auto parts and advanced film. Also offered R&D equipment necessary for the development of FC, organic materials, and catalyst materials.

One key feature of the MI-7000 is a trace report function that provides users with a report showing results from a large number of analyses collected from various types of inspection equipment and systems.

HITACHI

MI-7000

The model FineSAT HR has succeeded in enhancing the resolution by developing a new electronic circuit to exceed such a limit of ultrasonic inspection equipment.

Frequency of responding probe (MHz): 5–75

FS100ⅢHR

FineSAT Ⅴ can obtain and image data in 20 µm pitch in standard specification and in 10 µm or smaller pitch in optional specification, enabling detailed measurement of a large sample in a single scan. It also enables various image displays that support high-precision analysis/evaluation.

Probe frequency (MHz): 5–200

FSP8Ⅴ

Wafer Size: φ300mm (V notch type by SEMI standard)


DI4200

FS LINE can inspect large objects, which FineSAT series models cannot handle, including materials and components that increase in size, such as sputtering targets for FPDs and photovoltaic cells and ceramic components. In addition to FS LINE for single probe. FS LINE delivers both high-precision measurement and usability based on FineSAT, and is also focused on safety.

FS LINE

NS1500 Series Disk Surface Inspection System

NS1500

AS-5000

SR-7300

LS6600

IS2000

WAFER LINE is exclusively used for the inspection of wafers, such as SOI and laminated wafers. Full automation by using robots for conveyance, measurement and judgment is available on request. WAFER LINE has already built up actual results of continuous operations on several customers' mass-production lines, and is highly evaluated by customers.

WAFER LINE

FS LINE Hybrid is aimed at high damping with the array probe for low-frequency range. This allows users to simultaneously conduct the coupling inspection of target material and backing plate, and the void inspection inside the target material.

FS LINE Hybrid

Support φ100 mm, φ150 mm, φ200 mm patterned/ non-patterned wafer.
DI2800 uses scattering-intensity simulation technology to optimize the illumination and detection optics, enabling highly sensitive inspection of patterned-wafer defects developed during the manufacturing process. It has a detection sensitivity of 0.1-μm standard particle size on mirrored wafers. This makes it possible to examine even the incredibly small, 0.3-mm square size chips used in semiconductor devices in the IoT and automotive fields, with optimization of the inspection sequence enabling a defect inspection speed of over forty 200-mm wafer sheets per hour.

DI2800

FineSAT Ⅴ can obtain and image data in 20 µm pitch in standard specification and in 10 µm or smaller pitch in optional specification, enabling detailed measurement of a large sample in a single scan. It also enables various image displays that support high-precision analysis/evaluation.

Probe frequency (MHz): 5–300

FSP12Ⅴ

IS-2520

LS-5270 particle detection system, 30 wafers per hour, can detect particles on rough films, like CVD tungsten.

LS-5270

The model FineSAT HR has succeeded in enhancing the resolution by developing a new electronic circuit to exceed such a limit of ultrasonic inspection equipment.

Frequency of responding probe (MHz): 5–140

FS200ⅢHR

LS9300A

SR-7200

The LS9300A-EG (Edge Grip Type) is based on its previous model LS9300A, that is targeted for manufacturing advanced semiconductor devices, with high sensitivity and high throughput. The LS9300A-EG provides an edge grip function, which enables inspection without any contact to the backside of wafers. It is also equipped with a wafer flipping mechanism, which allows defect inspection of both the front and the backside of wafers. As a result, the new system offers advanced analysis capabilities and prediction of device failure caused by defects on the backside of wafers and other factors.

LS9300A-EG

IS-1510

FineSAT Hybrid, the analysis of abnormality can be implemented by the same equipment without transferring the device-under-test.
FineSAT Hybrid thus strongly supports the improvement of yield ratio in a short period.

Probe frequency (MHz): Single 5–75

FS100ⅢHy

The model FineSAT HR has succeeded in enhancing the resolution by developing a new electronic circuit to exceed such a limit of ultrasonic inspection equipment.

Frequency of responding probe (MHz): 5–300

FS300ⅢHR

The Scanning Acoustic Tomograph FineSAT uses ultrasonic waves to obtain images of internal voids, cracks, abrasion, etc., in materials such as semiconductor packages, electronic components, ceramics, metals, resins, in a non-destructive manner. FineSAT can also detect nanometer gaps that cannot be detected by X-ray equipment, infrared inspection equipment or optical microscope.

FineSAT Ⅲ, the third-generation equipment of FineSAT, has the best performance for basic functions such as high resolution, and it is equipped with the most enhanced analysis software that provides high-speed auto measurement, transmission/reflection simultaneous measurement function and defect auto-detection function. Furthermore, it has improved usability, including batch storage of flaw-searched data, and can be used in a wide range of applications; from large amount inspection in the production process to research and development.

Probe frequency (MHz)*1 = 5–75

FS100Ⅲ

LS9245

FineSAT Hybrid, the analysis of abnormality can be implemented by the same equipment without transferring the device-under-test.
FineSAT Hybrid thus strongly supports the improvement of yield ratio in a short period.

Probe frequency (MHz): Single 5–300

FS300ⅢHy

FS300III

IS-2600

WI-870 wafer inspection system, 167 sec/cm2 inspection rate, 0.5-micron resolution.

WI-870

IS-2610

NS7000 Series Disk Surface Inspection System

NS7000

LS7800

LS6800

FineSAT Hybrid, the analysis of abnormality can be implemented by the same equipment without transferring the device-under-test.
FineSAT Hybrid thus strongly supports the improvement of yield ratio in a short period.

Probe frequency (MHz): Single 5–140

FS200ⅢHy

I-5110

IS-2700E

IS 3200SE	

IS-3000SE

WI-890

LS-9000

IS 2700

IS-2500

IS 2700SE

IS3000 is a state-of-the-art dark-field type inspection system for detecting wafer pattern defects. While maintaining high throughput—the advantage of a dark-field-type defect-detection inspection device—the IS3000 is a ground-breaking detection device that surpasses conventional darkfield types in that it can also detect parts of shape defects and foreign bodies in places other than the top wafer surface (such as between interconnections and in contact holes).

IS-3000

LS9300

IS-1600

The Scanning Acoustic Tomograph FineSAT uses ultrasonic waves to obtain images of internal voids, cracks, abrasion, etc., in materials such as semiconductor packages, electronic components, ceramics, metals, resins, in a non-destructive manner. FineSAT can also detect nanometer gaps that cannot be detected by X-ray equipment, infrared inspection equipment or optical microscope.

FineSAT Ⅲ, the third-generation equipment of FineSAT, has the best performance for basic functions such as high resolution, and it is equipped with the most enhanced analysis software that provides high-speed auto measurement, transmission/reflection simultaneous measurement function and defect auto-detection function. Furthermore, it has improved usability, including batch storage of flaw-searched data, and can be used in a wide range of applications; from large amount inspection in the production process to research and development.

Probe frequency (MHz)*1 = 5–140

6" Fab For Sale from Moov - Click Here to Learn More

6" Fab For Sale from Moov - Click Here to Learn More

6" Fab For Sale from Moov - Click Here to Learn More

HITACHI

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FS100Ⅲ

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DI4200

FS LINE

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