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描述
Defect_Inspection(BF)配置
無配置OEM 代工型號說明
Wafer inspection. Core technology of DUV laser illumination and full polarization control, with simultaneous dual channel (brightfield reflected light and grayfield scattered light) collection optics unique to this product line sub-10nm defect sensitivity. It also enhances defect inspection on advanced patterning layers in FEOL and BEOL applications for the 1xnm node, addressing technologies that include logic, DRAM, 3D NAND, double and quadruple patterning, and EUV layers. n addition, the UVision 8 system incorporates Marker 2, the next generation of an integrated CAD-based application that combines customer regions-of-interest information and wafer characteristics based on customer needs. This capability enhances sensitivity while also boosting capture rates of prioritized defects of interest, enabling region-of-interest based binning, and tightening coordinate accuracy文檔
無文檔
類別
Defect Inspection
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
120677
晶圓尺寸:
未知
年份:
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
APPLIED MATERIALS (AMAT)
UVISION 8
類別
Defect Inspection
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
120677
晶圓尺寸:
未知
年份:
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
Defect_Inspection(BF)配置
無配置OEM 代工型號說明
Wafer inspection. Core technology of DUV laser illumination and full polarization control, with simultaneous dual channel (brightfield reflected light and grayfield scattered light) collection optics unique to this product line sub-10nm defect sensitivity. It also enhances defect inspection on advanced patterning layers in FEOL and BEOL applications for the 1xnm node, addressing technologies that include logic, DRAM, 3D NAND, double and quadruple patterning, and EUV layers. n addition, the UVision 8 system incorporates Marker 2, the next generation of an integrated CAD-based application that combines customer regions-of-interest information and wafer characteristics based on customer needs. This capability enhances sensitivity while also boosting capture rates of prioritized defects of interest, enabling region-of-interest based binning, and tightening coordinate accuracy文檔
無文檔