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APPLIED MATERIALS (AMAT) UVISION 3
    描述
    無描述
    配置
    無配置
    OEM 代工型號說明
    Applied UVision® 3 system, the industry’s highest productivity DUV1 Brightfield wafer inspection tool with the critical-defect detection sensitivity required for 45 nanometer (nm) FEOL2 and immersion lithography. Delivering significant advancements to Applied’s breakthrough UVision technology, this next-generation system triples the number of laser beams scanning the wafer to provide 40% faster throughput than any competitive system. Two new imaging modes extend sensitivity to 20nm, and a new flexible automatic defect classification engine enables quick access to defects of interest and faster yield learning. imaging modes in the illumination and collection path which address the contrast versatility required for periphery areas; innovative algorithms of high defect accuracy and stitch-to-stitch detection enable enhanced sensitivity on edge of array and on high-end devices; dual screen configuration with High Resolution Review, which minimizes SEM review time; and new automatic classification capabilities provide quick access to defect-of-interest to reduce yield learning cycle. Additionally, UVision 3’s proprietary ActiveScan technique dynamically compensates for process and color variations within and across wafers.
    文檔

    無文檔

    APPLIED MATERIALS (AMAT)

    UVISION 3

    verified-listing-icon

    已驗證

    類別
    Defect Inspection

    上次驗證: 超過60天前

    關鍵商品詳情

    條件:

    Used


    作業狀態:

    未知


    產品編號:

    29600


    晶圓尺寸:

    未知


    年份:

    2008


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    類似上架商品
    查看全部
    APPLIED MATERIALS (AMAT) UVISION 3

    APPLIED MATERIALS (AMAT)

    UVISION 3

    Defect Inspection
    年份: 2008條件: 二手
    上次驗證超過60天前

    APPLIED MATERIALS (AMAT)

    UVISION 3

    verified-listing-icon
    已驗證
    類別
    Defect Inspection
    上次驗證: 超過60天前
    listing-photo-9a869ad004b741fb831b9c90f40edc38-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1650/9a869ad004b741fb831b9c90f40edc38/fab17a979f3e4150bdbb7b2e92b7ed13_e0854bf525744efea37d18510564f2e11201a_mw.jpeg
    listing-photo-9a869ad004b741fb831b9c90f40edc38-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1650/9a869ad004b741fb831b9c90f40edc38/40e6486bc1bc41c9bc6899f68c82ae3b_f963d8d9f7804f8b8e3ae9832132e360_mw.png
    listing-photo-9a869ad004b741fb831b9c90f40edc38-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1650/9a869ad004b741fb831b9c90f40edc38/377d0ef24f6345b0881cdfc7b81ecf2a_fa702103fe3c46c69ee89d9fd7377512_mw.png
    listing-photo-9a869ad004b741fb831b9c90f40edc38-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1650/9a869ad004b741fb831b9c90f40edc38/50b00f6d770e4010b104990f8f309269_b31d9624ecb5402eac0965280dc148b6_mw.jpeg
    關鍵商品詳情

    條件:

    Used


    作業狀態:

    未知


    產品編號:

    29600


    晶圓尺寸:

    未知


    年份:

    2008


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    描述
    無描述
    配置
    無配置
    OEM 代工型號說明
    Applied UVision® 3 system, the industry’s highest productivity DUV1 Brightfield wafer inspection tool with the critical-defect detection sensitivity required for 45 nanometer (nm) FEOL2 and immersion lithography. Delivering significant advancements to Applied’s breakthrough UVision technology, this next-generation system triples the number of laser beams scanning the wafer to provide 40% faster throughput than any competitive system. Two new imaging modes extend sensitivity to 20nm, and a new flexible automatic defect classification engine enables quick access to defects of interest and faster yield learning. imaging modes in the illumination and collection path which address the contrast versatility required for periphery areas; innovative algorithms of high defect accuracy and stitch-to-stitch detection enable enhanced sensitivity on edge of array and on high-end devices; dual screen configuration with High Resolution Review, which minimizes SEM review time; and new automatic classification capabilities provide quick access to defect-of-interest to reduce yield learning cycle. Additionally, UVision 3’s proprietary ActiveScan technique dynamically compensates for process and color variations within and across wafers.
    文檔

    無文檔

    類似上架商品
    查看全部
    APPLIED MATERIALS (AMAT) UVISION 3

    APPLIED MATERIALS (AMAT)

    UVISION 3

    Defect Inspection年份: 2008條件: 二手上次驗證:超過60天前