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APPLIED MATERIALS (AMAT) UVISION 5
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    details attached.
    OEM 代工型號說明
    The Applied UVision 5 wafer inspection system detects yield-limiting defects in the critical patterning layers of 22nm and below logic and memory devices. Applied also offers the Applied DFinder system, the first darkfield wafer inspection system to use DUV laser scanning to detect particles as small as 40nm in interconnect layers. The UVision® 5 system isa member of the UVision wafer inspection product family, supporting the same proprietary core technology of deep ultraviolet (DUV) laser illumination, with simultaneous dual channel [brightfield (BF) reflected light and grayfield (GF) scattered light] collection optics. The system exhibits new defect inspection capabilities on advanced patterning layers in both FEOL and BEOL applications for 2xnm production and beyond, addressing such technologies as ArF immersion lithography, double and quad patterning, and extreme ultraviolet layers. The UVision 5 system’s dramatically increased light density enables detection of 1xnm killer defects - some never captured before - resulting in a twofold improvement in killer defect capture rates. This, in turn, results in a more accurate and comprehensive defect Pareto that significantly improves statistical process control in the wafer fab. The platform’s unique GF detection architecture now captures more light to enable detection of defects in the range of 1xnm (approximately the width of up to five DNA strands). New imaging modes improve detection sensitivity to further increase UVision technology leadership in GF scanning. Novel image processing algorithms reduce wafer noise by up to 50% in various types of memory structures, contributing to a higher capture rate, especially on BEOL layers.
    文檔

    APPLIED MATERIALS (AMAT)

    UVISION 5

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    已驗證

    類別

    Defect Inspection
    上次驗證: 超過60天前
    關鍵商品詳情

    條件:

    Used


    作業狀態:

    未知


    產品編號:

    68079


    晶圓尺寸:

    12"/300mm


    年份:

    2011

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    APPLIED MATERIALS (AMAT) UVISION 5
    APPLIED MATERIALS (AMAT)UVISION 5Defect Inspection
    年份: 0條件: 二手
    上次驗證15 天前

    APPLIED MATERIALS (AMAT)

    UVISION 5

    verified-listing-icon

    已驗證

    類別

    Defect Inspection
    上次驗證: 超過60天前
    listing-photo-9d4ecdf096c345508f7ddb0a4a062f95-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1877/9d4ecdf096c345508f7ddb0a4a062f95/1586048b1c644bf4ac127f53fba9cc3b_a4e8ff7b434e44ebb28dc29ba16b314e1201a_mw.jpeg
    listing-photo-9d4ecdf096c345508f7ddb0a4a062f95-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1877/9d4ecdf096c345508f7ddb0a4a062f95/5850047fc2be4e0ba93b80999bfee92b_d40707f3eaad4d30986d1ccd43c01a581201a_mw.jpeg
    關鍵商品詳情

    條件:

    Used


    作業狀態:

    未知


    產品編號:

    68079


    晶圓尺寸:

    12"/300mm


    年份:

    2011


    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    描述
    無描述
    配置
    details attached.
    OEM 代工型號說明
    The Applied UVision 5 wafer inspection system detects yield-limiting defects in the critical patterning layers of 22nm and below logic and memory devices. Applied also offers the Applied DFinder system, the first darkfield wafer inspection system to use DUV laser scanning to detect particles as small as 40nm in interconnect layers. The UVision® 5 system isa member of the UVision wafer inspection product family, supporting the same proprietary core technology of deep ultraviolet (DUV) laser illumination, with simultaneous dual channel [brightfield (BF) reflected light and grayfield (GF) scattered light] collection optics. The system exhibits new defect inspection capabilities on advanced patterning layers in both FEOL and BEOL applications for 2xnm production and beyond, addressing such technologies as ArF immersion lithography, double and quad patterning, and extreme ultraviolet layers. The UVision 5 system’s dramatically increased light density enables detection of 1xnm killer defects - some never captured before - resulting in a twofold improvement in killer defect capture rates. This, in turn, results in a more accurate and comprehensive defect Pareto that significantly improves statistical process control in the wafer fab. The platform’s unique GF detection architecture now captures more light to enable detection of defects in the range of 1xnm (approximately the width of up to five DNA strands). New imaging modes improve detection sensitivity to further increase UVision technology leadership in GF scanning. Novel image processing algorithms reduce wafer noise by up to 50% in various types of memory structures, contributing to a higher capture rate, especially on BEOL layers.
    文檔
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    APPLIED MATERIALS (AMAT) UVISION 5
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    Defect Inspection年份: 0條件: 二手上次驗證: 16 天前
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    APPLIED MATERIALS (AMAT)
    UVISION 5
    Defect Inspection年份: 0條件: 二手上次驗證: 22 天前