描述
System has always been under full service contract and is in very good conditioning. Uvision SP 200 is a BF (Bright Field) wafer inspection tool It is designed to inspect pattern wafers, but it can also inspect bare and unpatterned wafers Ligth source: Laser ( ג= 266 nm) Tool scans a wafer in a meander path Die to Die ” and Cell to Cell ” comparison capability Can use reflected --( BrigthField ) and scattered signal (GF = GreyField ) in parallel for detection On pattern wafers capable of detecting defects of 25 nm with 90 % Capture Rate (Data from D&E recipe配置
Uvision SP 200 is a BF (Bright Field) wafer inspection tool 200/300 mm capebiliity It is designed to inspect pattern wafers, but it can also inspect bare and unpatterned wafers Ligth source: Laser ( ג= 266 nm) Tool scans a wafer in a meander path Die to Die ” and Cell to Cell ” comparison capability Can use reflected --( BrigthField ) and scattered signal (GF = GreyField ) in parallel for detection On pattern wafers capable of detecting defects of 25 nm with 90 % Capture Rate (Data from D&E recipe,OEM 代工型號說明
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類別
Defect Inspection
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
Installed / Running
產品編號:
113572
晶圓尺寸:
12"/300mm
年份:
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
APPLIED MATERIALS (AMAT)
UVISION 200
類別
Defect Inspection
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
Installed / Running
產品編號:
113572
晶圓尺寸:
12"/300mm
年份:
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
System has always been under full service contract and is in very good conditioning. Uvision SP 200 is a BF (Bright Field) wafer inspection tool It is designed to inspect pattern wafers, but it can also inspect bare and unpatterned wafers Ligth source: Laser ( ג= 266 nm) Tool scans a wafer in a meander path Die to Die ” and Cell to Cell ” comparison capability Can use reflected --( BrigthField ) and scattered signal (GF = GreyField ) in parallel for detection On pattern wafers capable of detecting defects of 25 nm with 90 % Capture Rate (Data from D&E recipe配置
Uvision SP 200 is a BF (Bright Field) wafer inspection tool 200/300 mm capebiliity It is designed to inspect pattern wafers, but it can also inspect bare and unpatterned wafers Ligth source: Laser ( ג= 266 nm) Tool scans a wafer in a meander path Die to Die ” and Cell to Cell ” comparison capability Can use reflected --( BrigthField ) and scattered signal (GF = GreyField ) in parallel for detection On pattern wafers capable of detecting defects of 25 nm with 90 % Capture Rate (Data from D&E recipe,OEM 代工型號說明
未提供文檔
無文檔