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APPLIED MATERIALS (AMAT) COMPLUS MP
  • APPLIED MATERIALS (AMAT) COMPLUS MP
  • APPLIED MATERIALS (AMAT) COMPLUS MP
  • APPLIED MATERIALS (AMAT) COMPLUS MP
描述
Darkfield Inspection
配置
無配置
OEM 代工型號說明
AMAT / APPLIED MATERIALS ComPlus MP is a wafer inspection system which can be used with 8" wafer sizes. The ComPlus-EV can be further enhanced with the MP (Multi-Perspective) option, which extends the system's exceptional capabilities to perform additional brightfield applications, including the detection of defects in the transistor area such as STI, gate, and tungsten plug layers. The MP option expands the number of detectors and magnifications, enabling higher sensitivity to flat defects at an increased capture rate, providing significantly higher throughput and reduced cost of ownership.
文檔

無文檔

類別
Defect Inspection

上次驗證: 超過30天前

關鍵商品詳情

條件:

Used


作業狀態:

未知


產品編號:

83117


晶圓尺寸:

8"/200mm


年份:

未知


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available

APPLIED MATERIALS (AMAT)

COMPLUS MP

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已驗證
類別
Defect Inspection
上次驗證: 超過30天前
listing-photo-311c14888888489ea2197d7484daa27f-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
關鍵商品詳情

條件:

Used


作業狀態:

未知


產品編號:

83117


晶圓尺寸:

8"/200mm


年份:

未知


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
Darkfield Inspection
配置
無配置
OEM 代工型號說明
AMAT / APPLIED MATERIALS ComPlus MP is a wafer inspection system which can be used with 8" wafer sizes. The ComPlus-EV can be further enhanced with the MP (Multi-Perspective) option, which extends the system's exceptional capabilities to perform additional brightfield applications, including the detection of defects in the transistor area such as STI, gate, and tungsten plug layers. The MP option expands the number of detectors and magnifications, enabling higher sensitivity to flat defects at an increased capture rate, providing significantly higher throughput and reduced cost of ownership.
文檔

無文檔