概述

Lam introduced its Epic high density plasma (HDP) CVD system in July 1993. The Epic system incorporates electron cyclotron resonance (ECR) technology to form a high-density, low-pressure plasma. Its ability to deposit and etch simultaneously an intermetal dielectric film enables it to fill gaps as small as 0.35 micron and below and to generate a film that is easily planarized. The resulting film exhibits superior electrical qualities and significantly reduces the need for additional chemical mechanical polishing.