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EVGroup (EVG) EVG101
  • EVGroup (EVG) EVG101
描述
Fully operational and can handle up to 200mm.
配置
無配置
OEM 代工型號說明
EVG 101 Advanced Resist Processing System The EVG101 resist processing system performs R&D-type processes on a single chamber design, which is fully compatible with EVG’s automated systems. The EVG101 supports wafers up to 300 mm and can be configured for spin or spray coating and developing. Conformal layers of photoresist or polymers are achieved on 3D structured wafers for interconnection techniques with EVG’s advanced OmniSpray coating technology. This ensures low material consumption of precious high-viscosity photoresists or polymers while improving uniformity and resist spreading options.
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PREFERRED
 
SELLER
類別
Coaters & Developers

上次驗證: 超過60天前

Buyer pays 12% premium of final sale price
關鍵商品詳情

條件:

Used


作業狀態:

未知


產品編號:

111649


晶圓尺寸:

8"/200mm


年份:

2011


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
PREFERRED
 
SELLER

EVGroup (EVG)

EVG101

verified-listing-icon
已驗證
類別
Coaters & Developers
上次驗證: 超過60天前
listing-photo-ade020ab1d8a43aa9def55dbc62ffe97-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1509/ade020ab1d8a43aa9def55dbc62ffe97/6df5e878c8b64742ae8b373336e11311_6fdd62d4142e48a98619c23e0b289b8e_mw.jpeg
Buyer pays 12% premium of final sale price
關鍵商品詳情

條件:

Used


作業狀態:

未知


產品編號:

111649


晶圓尺寸:

8"/200mm


年份:

2011


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
Fully operational and can handle up to 200mm.
配置
無配置
OEM 代工型號說明
EVG 101 Advanced Resist Processing System The EVG101 resist processing system performs R&D-type processes on a single chamber design, which is fully compatible with EVG’s automated systems. The EVG101 supports wafers up to 300 mm and can be configured for spin or spray coating and developing. Conformal layers of photoresist or polymers are achieved on 3D structured wafers for interconnection techniques with EVG’s advanced OmniSpray coating technology. This ensures low material consumption of precious high-viscosity photoresists or polymers while improving uniformity and resist spreading options.
文檔

無文檔