描述
Lapping & Polishing配置
無配置OEM 代工型號說明
The G&P Technology POLI-400L was designed to provide flexible CMP process capability for applications where ease of use, reliability, and a compact design are essential. Capable of working with substrates with up to 150mm diameter, the POLI-400L offers configuration choices in carrier type, conditioner technology, pad profiling, process measurement and monitoring systems. The POLI-400L utilizes an intuitive touch-screen user interface and a robust PLC control system that includes the multiple process steps and detailed process controls that users expect. Reliability and flexibility is further enhanced by relying on manual single substrate loading. The G&P Technology POLI-400L delivers high-value performance and research capability in a package that is compact and economical.文檔
無文檔
類別
CMP
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
131524
晶圓尺寸:
未知
年份:
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
AXUS TECHNOLOGY
G&P POLI-400L
類別
CMP
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
131524
晶圓尺寸:
未知
年份:
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
Lapping & Polishing配置
無配置OEM 代工型號說明
The G&P Technology POLI-400L was designed to provide flexible CMP process capability for applications where ease of use, reliability, and a compact design are essential. Capable of working with substrates with up to 150mm diameter, the POLI-400L offers configuration choices in carrier type, conditioner technology, pad profiling, process measurement and monitoring systems. The POLI-400L utilizes an intuitive touch-screen user interface and a robust PLC control system that includes the multiple process steps and detailed process controls that users expect. Reliability and flexibility is further enhanced by relying on manual single substrate loading. The G&P Technology POLI-400L delivers high-value performance and research capability in a package that is compact and economical.文檔
無文檔