描述
Dielectric CMP配置
無配置OEM 代工型號說明
The integrated post-CMP Desica® cleaner uses unique full-immersion Marangoni® vapor drying technology to virtually eliminate watermark defects and dramatically reduce particle contamination. The wafer is so clean after CMP (<100 45nm defects on a 300mm wafer) that compared to the entire surface area of the earth, the remaining contaminants would cover only 0.3 acres, the size of a medium sized suburban garden The Applied Reflexion LK CMP system also implements a full suite of endpoint methods, in-line metrology and advanced process control capabilities that ensure excellent within-wafer and wafer-to-wafer process control and repeatability for all planarization applications. Its patented window-in-pad technology enables accurate real-time polish control of every wafer without compromising throughput. The new FullVision™ in-situ endpoint system, for all stop-in and stop-on dielectric applications, uses broadband spectroscopy to significantly improve Cpk and minimize wafer scrap caused by drifts in consumable sets and incoming wafer variations.文檔
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APPLIED MATERIALS (AMAT)
REFLEXION LK
已驗證
類別
CMP
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
91780
晶圓尺寸:
未知
年份:
未知
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Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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APPLIED MATERIALS (AMAT)
REFLEXION LK
已驗證
類別
CMP
上次驗證: 30 天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
91780
晶圓尺寸:
未知
年份:
未知
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
Dielectric CMP配置
無配置OEM 代工型號說明
The integrated post-CMP Desica® cleaner uses unique full-immersion Marangoni® vapor drying technology to virtually eliminate watermark defects and dramatically reduce particle contamination. The wafer is so clean after CMP (<100 45nm defects on a 300mm wafer) that compared to the entire surface area of the earth, the remaining contaminants would cover only 0.3 acres, the size of a medium sized suburban garden The Applied Reflexion LK CMP system also implements a full suite of endpoint methods, in-line metrology and advanced process control capabilities that ensure excellent within-wafer and wafer-to-wafer process control and repeatability for all planarization applications. Its patented window-in-pad technology enables accurate real-time polish control of every wafer without compromising throughput. The new FullVision™ in-situ endpoint system, for all stop-in and stop-on dielectric applications, uses broadband spectroscopy to significantly improve Cpk and minimize wafer scrap caused by drifts in consumable sets and incoming wafer variations.文檔
無文檔