描述
FEB Length measurement配置
-Process: High-resolution FEB length measuring device -SMIF Interface: None Overall Specifications -Wafer Size: Supports 8-inch wafers (SEMI standard) -Length measurement method: Cursor and line profile method -Range: 0.1μm～10μm -Reproducibility: 1% ± or 5 nm (3σ), whichever is greater -throughput: Continuous measurement: 20 sheets/hour (5-point measurement/6-inch wafer) -Secondary electron image resolution: 5nm (50Å) (accelerating voltage 0.8kV, TV integrated image) -Usage magnification: × approx. 110 (optical microscope image) ×1,000~150,000(SEM image) -Measurement mode: Automatic measurement with auto-address/image recognition, manual measurement -stage Travel range: X,Y 0~200mm -drive Pulse Motor -control Computer Control Positioning control by linear encoder -Drive speed Up to 50 mm/s Loader -Between the loader room ⇒ the stage Automatic vacuum evacuation followed automatic loading Automatic wafer chuck -Wafer carrier ⇒ loader chamber Cassette to cassette autoloader (26 sheets) Inside the load lock: Electrostatic adsorption method -Cassette to cassette autoloader -method Random access type. 2 cassettes -Chucking Wafer backside vacuum adsorption -Orifura Alignment Automatic detection and adjustment by optical sensor -Electron optics -Accelerating voltage 700~1300V(10V variable) -Lens system Electromagnetic convergent lens system, FCM objective lens -Objective lens aperture: Heated thin film movable diaphragm (4-hole switching by outside vacuum) can be finely -adjusted -Scanning coil Two-stage electromagnetic deflection -Astigmatism 8-pole electromagnetic system (X, Y) -Probe Current Monitor Built-in Faraday cup with automatic length measurement function -optical microscope 1.2mm square field of view Black and white image, with CCD camera Control and display system CRT for observation and control EWS(GUI) 19-inch type, integrating image display Display of wafer maps, measurement values, stage coordinates, etc. for computer interaction Scanning Mode Built-in TV scanning, auto brightness, and contrast record Photography equipment (optional) Safeguards With emergency shut-off switch (mushroom-shaped) Length measurement data processing system File saving function 500MB hard disk for system programs 3.5" F/D driver, 3.5" magneto-optical disk driver With various condition file saving function -data processing Mean, standard deviation, maximum/minimum value -Print output with 80-digit thermal printer -Vacuum exhaust system method: Fully automatic dry clean method vacuum pump: 3 ion pumps 2 turbomolecular pumps 2 rotary pumps -Safeguards With power failure/vacuum safety Size: -Main unit 1650(W)×1890(D)×1650(H) -Control unit 600(W)×1331(D)×1800(H) -Power supply section 535(W)×600(D)×1500(H) -Rotary pump 360(W)×640(D)×520(H) -power 100V, 5kVA, 60Hz (single phase) Environmental conditions magnetic field AC power synchronization frequency component 0.3μT or less DC magnetic field fluctuation: 0.1μT or less vibration Frequency 5Hz Amplitude (peak-to-peak) 3μm noise 75dB or less (C characteristics) room temperature 20～25℃(Δt=±2℃)OEM 代工型號說明
20 (automatic operation) (6-inch wafer, 5-point measurement) wafer sizes: 5, 6, 8文檔
無文檔
HITACHI
S-8820
已驗證
類別
CD-SEM
上次驗證: 9 天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
114037
晶圓尺寸:
8"/200mm
年份:
1997
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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HITACHI
S-8820
類別
CD-SEM
上次驗證: 9 天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
114037
晶圓尺寸:
8"/200mm
年份:
1997
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
FEB Length measurement配置
-Process: High-resolution FEB length measuring device -SMIF Interface: None Overall Specifications -Wafer Size: Supports 8-inch wafers (SEMI standard) -Length measurement method: Cursor and line profile method -Range: 0.1μm～10μm -Reproducibility: 1% ± or 5 nm (3σ), whichever is greater -throughput: Continuous measurement: 20 sheets/hour (5-point measurement/6-inch wafer) -Secondary electron image resolution: 5nm (50Å) (accelerating voltage 0.8kV, TV integrated image) -Usage magnification: × approx. 110 (optical microscope image) ×1,000~150,000(SEM image) -Measurement mode: Automatic measurement with auto-address/image recognition, manual measurement -stage Travel range: X,Y 0~200mm -drive Pulse Motor -control Computer Control Positioning control by linear encoder -Drive speed Up to 50 mm/s Loader -Between the loader room ⇒ the stage Automatic vacuum evacuation followed automatic loading Automatic wafer chuck -Wafer carrier ⇒ loader chamber Cassette to cassette autoloader (26 sheets) Inside the load lock: Electrostatic adsorption method -Cassette to cassette autoloader -method Random access type. 2 cassettes -Chucking Wafer backside vacuum adsorption -Orifura Alignment Automatic detection and adjustment by optical sensor -Electron optics -Accelerating voltage 700~1300V(10V variable) -Lens system Electromagnetic convergent lens system, FCM objective lens -Objective lens aperture: Heated thin film movable diaphragm (4-hole switching by outside vacuum) can be finely -adjusted -Scanning coil Two-stage electromagnetic deflection -Astigmatism 8-pole electromagnetic system (X, Y) -Probe Current Monitor Built-in Faraday cup with automatic length measurement function -optical microscope 1.2mm square field of view Black and white image, with CCD camera Control and display system CRT for observation and control EWS(GUI) 19-inch type, integrating image display Display of wafer maps, measurement values, stage coordinates, etc. for computer interaction Scanning Mode Built-in TV scanning, auto brightness, and contrast record Photography equipment (optional) Safeguards With emergency shut-off switch (mushroom-shaped) Length measurement data processing system File saving function 500MB hard disk for system programs 3.5" F/D driver, 3.5" magneto-optical disk driver With various condition file saving function -data processing Mean, standard deviation, maximum/minimum value -Print output with 80-digit thermal printer -Vacuum exhaust system method: Fully automatic dry clean method vacuum pump: 3 ion pumps 2 turbomolecular pumps 2 rotary pumps -Safeguards With power failure/vacuum safety Size: -Main unit 1650(W)×1890(D)×1650(H) -Control unit 600(W)×1331(D)×1800(H) -Power supply section 535(W)×600(D)×1500(H) -Rotary pump 360(W)×640(D)×520(H) -power 100V, 5kVA, 60Hz (single phase) Environmental conditions magnetic field AC power synchronization frequency component 0.3μT or less DC magnetic field fluctuation: 0.1μT or less vibration Frequency 5Hz Amplitude (peak-to-peak) 3μm noise 75dB or less (C characteristics) room temperature 20～25℃(Δt=±2℃)OEM 代工型號說明
20 (automatic operation) (6-inch wafer, 5-point measurement) wafer sizes: 5, 6, 8文檔
無文檔