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描述
無描述配置
CD SEM – Stage performance resolution = 1nm (xy) / 4nm (z) with 2µm accuracy – Image resolution = 1.8nm @ 500eV – Side wall imaging = 12 deg tilt at 4 directions – HAR imaging = 1:30 features – Accelerating voltage = 0.2kV to 2.5kV – Extraction V up to 4KV, Probe current = 5pA – 500pA – 4 wafer cassette loading portsOEM 代工型號說明
The Applied VeritySEM 2 Metrology system offers unparalleled precision and maximum production throughput, measuring 45nm gate, low-k, and ArF resist features with 3Å accuracy, essential for 45nm device production. Enhanced by its advanced automation, this system drastically reduces the need for tool operators and cuts down on CD-SEM tools in fabs. A standout feature, the OPC Check, automates the Optical Proximity Correction mask qualification, catering to evolving chipmaker needs. Proprietary SEM technology ensures speedy electron movement and precise measurements, resulting in top-notch resolution.文檔
無文檔
類別
CD-SEM
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
42944
晶圓尺寸:
8"/200mm
年份:
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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APPLIED MATERIALS (AMAT)
VeritySEM 2
類別
CD-SEM
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
42944
晶圓尺寸:
8"/200mm
年份:
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
無描述配置
CD SEM – Stage performance resolution = 1nm (xy) / 4nm (z) with 2µm accuracy – Image resolution = 1.8nm @ 500eV – Side wall imaging = 12 deg tilt at 4 directions – HAR imaging = 1:30 features – Accelerating voltage = 0.2kV to 2.5kV – Extraction V up to 4KV, Probe current = 5pA – 500pA – 4 wafer cassette loading portsOEM 代工型號說明
The Applied VeritySEM 2 Metrology system offers unparalleled precision and maximum production throughput, measuring 45nm gate, low-k, and ArF resist features with 3Å accuracy, essential for 45nm device production. Enhanced by its advanced automation, this system drastically reduces the need for tool operators and cuts down on CD-SEM tools in fabs. A standout feature, the OPC Check, automates the Optical Proximity Correction mask qualification, catering to evolving chipmaker needs. Proprietary SEM technology ensures speedy electron movement and precise measurements, resulting in top-notch resolution.文檔
無文檔