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APPLIED MATERIALS (AMAT) VERASEM 3D
    描述
    無描述
    配置
    Please see attached configuration Type: SMIF Wafer Size: 300mm Reticle Size: 6 inch Wafer OF Type: Notch at 6 Software Version: HDD Exiting No missing parts
    OEM 代工型號說明
    The AMAT VeraSEM 3D is an advanced semiconductor imaging system introduced by Applied Materials. It offers three-dimensional imaging capabilities for chip features as small as 0.10 micron, allowing users to gain valuable insights into semiconductor structures with high precision. The system's enhanced efficiency makes it a powerful tool for semiconductor analysis and research.
    文檔
    類別
    CD-SEM

    上次驗證: 超過60天前

    關鍵商品詳情

    條件:

    Used


    作業狀態:

    未知


    產品編號:

    78760


    晶圓尺寸:

    12"/300mm


    年份:

    2001


    Logistics Support
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available

    APPLIED MATERIALS (AMAT)

    VERASEM 3D

    verified-listing-icon
    已驗證
    類別
    CD-SEM
    上次驗證: 超過60天前
    listing-photo-9b6fca9d5b7e4d4386c9cd15fea89684-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/73362/9b6fca9d5b7e4d4386c9cd15fea89684/7d88ea429ee447709cb94827ccc9e8f5_b106d16ca3b64ab5ac7489a6979c137b_mw.jpeg
    listing-photo-9b6fca9d5b7e4d4386c9cd15fea89684-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/73362/9b6fca9d5b7e4d4386c9cd15fea89684/d8061260f8ab4f238d3cd5e34b993d19_0cb7a73e3ebd4e85a30ec15df861e3bc1201a_mw.jpeg
    listing-photo-9b6fca9d5b7e4d4386c9cd15fea89684-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/73362/9b6fca9d5b7e4d4386c9cd15fea89684/c243059777224e6cad2f9b70e98871cf_8b0a22e4804544ae8b5981a894d5e60f45005c_mw.jpeg
    listing-photo-9b6fca9d5b7e4d4386c9cd15fea89684-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/73362/9b6fca9d5b7e4d4386c9cd15fea89684/c6051b92a8944830bbe21fe318c3304d_ff2e535476614c6fac995c0dcfac3e591201a_mw.jpeg
    listing-photo-9b6fca9d5b7e4d4386c9cd15fea89684-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/73362/9b6fca9d5b7e4d4386c9cd15fea89684/e29219df4e944bf2b07b9f800957cdad_107dc734f29f451aa10f26227875148a1201a_mw.jpeg
    listing-photo-9b6fca9d5b7e4d4386c9cd15fea89684-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/73362/9b6fca9d5b7e4d4386c9cd15fea89684/c9d16c2fabde4b1cbe3dc97227aaf968_6bc1de5c1b794d9a903aaad6751e9a871201a_mw.jpeg
    listing-photo-9b6fca9d5b7e4d4386c9cd15fea89684-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/73362/9b6fca9d5b7e4d4386c9cd15fea89684/8f4cc88100f349588873bf9c639b7cf2_ee75c42d92c54f06b76724852403fdbb1201a_mw.jpeg
    關鍵商品詳情

    條件:

    Used


    作業狀態:

    未知


    產品編號:

    78760


    晶圓尺寸:

    12"/300mm


    年份:

    2001


    Logistics Support
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    描述
    無描述
    配置
    Please see attached configuration Type: SMIF Wafer Size: 300mm Reticle Size: 6 inch Wafer OF Type: Notch at 6 Software Version: HDD Exiting No missing parts
    OEM 代工型號說明
    The AMAT VeraSEM 3D is an advanced semiconductor imaging system introduced by Applied Materials. It offers three-dimensional imaging capabilities for chip features as small as 0.10 micron, allowing users to gain valuable insights into semiconductor structures with high precision. The system's enhanced efficiency makes it a powerful tool for semiconductor analysis and research.
    文檔