描述
無描述配置
無配置OEM 代工型號說明
The T-3002-PRO series is Tresky’s most flexible die bonding platform. The systems can run all basic functions as well as the industries most advanced applications by adding a wide range of available options. As with all of Tresky’s products, the PRO incorporates True Vertical Technology™ which guarantees parallelism between chip and substrate at any bond height. Together with superior ergonomics the PRO platform is the industry’s most sophisticated system in its class and with the new PC software even easier to operate. The T-3002-PRO is a Chip Bonder with programmable and motorized Z-axis. It is also equipped with Tresky’s proven die ejector system for pick-up from wafer文檔
無文檔
TRESKY
3002/3102
已驗證
類別
Bonders
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
16458
晶圓尺寸:
8"/200mm
年份:
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
TRESKY
3002/3102
類別
Bonders
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
16458
晶圓尺寸:
8"/200mm
年份:
未知
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
無描述配置
無配置OEM 代工型號說明
The T-3002-PRO series is Tresky’s most flexible die bonding platform. The systems can run all basic functions as well as the industries most advanced applications by adding a wide range of available options. As with all of Tresky’s products, the PRO incorporates True Vertical Technology™ which guarantees parallelism between chip and substrate at any bond height. Together with superior ergonomics the PRO platform is the industry’s most sophisticated system in its class and with the new PC software even easier to operate. The T-3002-PRO is a Chip Bonder with programmable and motorized Z-axis. It is also equipped with Tresky’s proven die ejector system for pick-up from wafer文檔
無文檔