描述
Applications: This system bonds a product substrate and product chips with high-pressure air and high-temperature heart for IC development and manufacturing. This system is generally called a permanent bonder.配置
- System Configuration: This system consist of wafer processing equipment and a peripheral device (air booster) that supplies high-pressure air. - Equipment Configuration: The equipment consist of two types of blocks: Carrier Station Block (CSB) and Gang Air Bonding Block (GAB).OEM 代工型號說明
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TEL / TOKYO ELECTRON
SYNAPSE
已驗證
類別
Bonders
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
44844
晶圓尺寸:
12"/300mm
年份:
2015
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
TEL / TOKYO ELECTRON
SYNAPSE
已驗證
類別
Bonders
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
44844
晶圓尺寸:
12"/300mm
年份:
2015
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
Applications: This system bonds a product substrate and product chips with high-pressure air and high-temperature heart for IC development and manufacturing. This system is generally called a permanent bonder.配置
- System Configuration: This system consist of wafer processing equipment and a peripheral device (air booster) that supplies high-pressure air. - Equipment Configuration: The equipment consist of two types of blocks: Carrier Station Block (CSB) and Gang Air Bonding Block (GAB).OEM 代工型號說明
未提供文檔
無文檔