描述
無描述配置
-SOI version( de bonder or temporary bonder) -Load, unload stations, Genmark robot, cleaning station, bonding Station and inspection.OEM 代工型號說明
The EVG805 is a semi-automated system for debonding of temporary bonded and processed wafer stacks consisting of a device wafer, carrier wafer and an intermediate temporary bonding adhesive. The tool either supports thermal or mechanical debonding. The thin wafer can be unloaded on a single substrate carrier for safe and reliable transport between tools.文檔
無文檔
EVGroup (EVG)
EVG805
已驗證
類別
Bonders
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
55578
晶圓尺寸:
未知
年份:
2000
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
EVGroup (EVG)
EVG805
類別
Bonders
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
55578
晶圓尺寸:
未知
年份:
2000
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
無描述配置
-SOI version( de bonder or temporary bonder) -Load, unload stations, Genmark robot, cleaning station, bonding Station and inspection.OEM 代工型號說明
The EVG805 is a semi-automated system for debonding of temporary bonded and processed wafer stacks consisting of a device wafer, carrier wafer and an intermediate temporary bonding adhesive. The tool either supports thermal or mechanical debonding. The thin wafer can be unloaded on a single substrate carrier for safe and reliable transport between tools.文檔
無文檔