描述
無描述配置
無配置OEM 代工型號說明
The EVG501 is a versatile and flexible wafer bonding system, capable of handling substrate sizes ranging from single chips to 150 mm (200 mm with a 200 mm bond chamber). It supports various wafer bonding processes, including anodic, glass frit, solder, eutectic, transient liquid phase, and direct bonding. The system's design allows for easy access to the bond chamber and tooling, enabling quick and straightforward retooling for different wafer sizes and processes. With a conversion time of less than 5 minutes, the EVG501 offers efficient and seamless transitions between different bonding applications, making it an ideal solution for diverse wafer bonding needs.文檔
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EVGroup (EVG)
EVG501
已驗證
類別
Bonders
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
60479
晶圓尺寸:
未知
年份:
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
EVGroup (EVG)
EVG501
類別
Bonders
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
60479
晶圓尺寸:
未知
年份:
未知
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
無描述配置
無配置OEM 代工型號說明
The EVG501 is a versatile and flexible wafer bonding system, capable of handling substrate sizes ranging from single chips to 150 mm (200 mm with a 200 mm bond chamber). It supports various wafer bonding processes, including anodic, glass frit, solder, eutectic, transient liquid phase, and direct bonding. The system's design allows for easy access to the bond chamber and tooling, enabling quick and straightforward retooling for different wafer sizes and processes. With a conversion time of less than 5 minutes, the EVG501 offers efficient and seamless transitions between different bonding applications, making it an ideal solution for diverse wafer bonding needs.文檔
無文檔