描述
無描述配置
-Unit setup for thermal bonding and hot embossing. -Windows 2000 -Unit setup for thermal bonding, not anodic bonding. -Will need to hook it to a three phase power source and compressed air/ nitrogen. -Fully operational -Last used in 2019OEM 代工型號說明
The EVG520 HE is a cutting-edge semi-automated hot embossing system, specifically tailored for high-precision thermoplastic substrate imprinting. Capable of accommodating substrates up to 200 mm in diameter, it seamlessly integrates with industry-standard semiconductor manufacturing technologies. The system features high-vacuum and high-contact force capabilities, along with a universal embossing chamber, ensuring efficient and reliable processing. Its versatility allows for working with a comprehensive range of polymers suitable for hot embossing applications, making it an ideal choice for advanced manufacturing needs.文檔
EVGroup (EVG)
EVG520 HE
已驗證
類別
Bonders
上次驗證: 超過30天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
55796
晶圓尺寸:
8"/200mm
年份:
2005
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
EVGroup (EVG)
EVG520 HE
類別
Bonders
上次驗證: 超過30天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
55796
晶圓尺寸:
8"/200mm
年份:
2005
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available