概述

The EVG GEMINI FB XT is an advanced fusion bonding system designed for high-precision applications. It excels in memory stacking, 3D systems on chip (SoC), backside illuminated CMOS image sensor stacking, and die partitioning. The system incorporates the SmartView NT3 bond aligner, specifically developed for fusion and hybrid wafer bonding alignment with an impressive accuracy of less than 50 nm. It supports wafer diameters of 200mm and 300mm, offering a blend of productivity, alignment, and overlay precision.