描述
無描述配置
<p>Tool is running production.</p><p>Inspect to confirm configuration and condition of tool.</p><p> </p><p>DIE ATTACH ESEC 2008HS3 plus</p><p> </p><p>Stack loader</p><p>Magazine to magazine</p><p>Bond time: 0 - 32 sec</p><p>Bond force: 0.5 N - 50 N</p><p>Bond accuracy: 25 um @ 3 sigma</p><p>Pad down set: 0 - 3 mm / 0 - 120 mil</p><p>Max. Pitch: 80 mm / 3.1"</p><p>metal lead frames (e.g. SOT, SOIC, TSOP and QFN)</p><p>organic substrates (e.g. BGA, Flex BGA, Singulated BGA, ceramics)</p><p>Lead frame / substrate length: 120-260mm</p><p><span style="color: rgb(62, 62, 60);">Lead frame / substrate </span>width: 9-90mm</p><p><span style="color: rgb(62, 62, 60);">Lead frame / substrate </span>thickness: 0.1-0.4mm</p><p><span style="color: rgb(62, 62, 60);">Lead frame / substrate </span>pitch: max. 80mm</p><p>Max. 3000 die per pitch</p><p>Max. 12000 die per lead frame</p><p>X Range: Max. 80 mm / 3.15"</p><p>Y-Bond range: Max. 66 mm / 2.6" (Leadframe width 90 mm / 3.54")</p><p>Die size: 10 mil (0.25 mm) - 1" (25.4 mm)</p><p>Die rotation angle: 270°</p><p>Magazines length: 120 - 270 mm / 4.72 - 10.23"</p><p>Magazines width: 12 - 90 mm / 0.47 - 3.54"</p><p>Magazines height: 60 - 160 mm / 2.36 - 6.3"</p><p>Wafer handler move method: 8" all & 12" half move</p>OEM 代工型號說明
The ESEC 2008hs3 Plus is a die bonder manufactured by ESEC. It is designed to handle wafers up to 300mm in size and has a bond accuracy of 25 um @ 3 sigma. This tool is capable of precisely attaching dies to substrates with a high degree of accuracy, making it a valuable tool in the semiconductor manufacturing process.文檔
無文檔
BESI / ESEC
2008 hS3 plus
已驗證
類別
Bonders
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
22556
晶圓尺寸:
12"/300mm
年份:
2006
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
BESI / ESEC
2008 hS3 plus
已驗證
類別
Bonders
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
22556
晶圓尺寸:
12"/300mm
年份:
2006
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
無描述配置
<p>Tool is running production.</p><p>Inspect to confirm configuration and condition of tool.</p><p> </p><p>DIE ATTACH ESEC 2008HS3 plus</p><p> </p><p>Stack loader</p><p>Magazine to magazine</p><p>Bond time: 0 - 32 sec</p><p>Bond force: 0.5 N - 50 N</p><p>Bond accuracy: 25 um @ 3 sigma</p><p>Pad down set: 0 - 3 mm / 0 - 120 mil</p><p>Max. Pitch: 80 mm / 3.1"</p><p>metal lead frames (e.g. SOT, SOIC, TSOP and QFN)</p><p>organic substrates (e.g. BGA, Flex BGA, Singulated BGA, ceramics)</p><p>Lead frame / substrate length: 120-260mm</p><p><span style="color: rgb(62, 62, 60);">Lead frame / substrate </span>width: 9-90mm</p><p><span style="color: rgb(62, 62, 60);">Lead frame / substrate </span>thickness: 0.1-0.4mm</p><p><span style="color: rgb(62, 62, 60);">Lead frame / substrate </span>pitch: max. 80mm</p><p>Max. 3000 die per pitch</p><p>Max. 12000 die per lead frame</p><p>X Range: Max. 80 mm / 3.15"</p><p>Y-Bond range: Max. 66 mm / 2.6" (Leadframe width 90 mm / 3.54")</p><p>Die size: 10 mil (0.25 mm) - 1" (25.4 mm)</p><p>Die rotation angle: 270°</p><p>Magazines length: 120 - 270 mm / 4.72 - 10.23"</p><p>Magazines width: 12 - 90 mm / 0.47 - 3.54"</p><p>Magazines height: 60 - 160 mm / 2.36 - 6.3"</p><p>Wafer handler move method: 8" all & 12" half move</p>OEM 代工型號說明
The ESEC 2008hs3 Plus is a die bonder manufactured by ESEC. It is designed to handle wafers up to 300mm in size and has a bond accuracy of 25 um @ 3 sigma. This tool is capable of precisely attaching dies to substrates with a high degree of accuracy, making it a valuable tool in the semiconductor manufacturing process.文檔
無文檔