2008 hS3 plus
類別
Bonders概述
The ESEC 2008hs3 Plus is a die bonder manufactured by ESEC. It is designed to handle wafers up to 300mm in size and has a bond accuracy of 25 um @ 3 sigma. This tool is capable of precisely attaching dies to substrates with a high degree of accuracy, making it a valuable tool in the semiconductor manufacturing process.
活躍中的上架商品
2
服務
檢驗、保險、評估、物流